A New Platform Embedded Chipset Offering Flexibility and Reliability for Today’s Enterprise Applications Product Overview The Embedded Enterprise Chipsets offer three different configurations to meet your needs, the SR5690, SR5670 and the SR5650. All three versions of I/O bridges from the SR5690 with 42 PCIe® lanes and 11 engines, to the SR5670 with 30 PCIe lanes with 9 engines, down to the SR5650 with 22 PCIe lanes and 8 engines paired with the SP5100 southbridge offer HyperTransportTM 3.0 technology, PCIe Generation 2, SATA 2.5 and USB 2.0. Additionally all three offer enterprise features such as HT error handling, PCIe AER, Data Poisoning Passthrough, PCIe end-to-end CRC and AMD-Vi (IOMMU 1.2). These chipset combinations combined with AMD Embedded Processor offerings are targeted at embedded applications such as telecom, storage, test and measurement, and industrial automation. The growing demands of embedded enterprise applications are served by this new solution through reliability, scalability and excellent power efficiency. Scalability All three combinations of Embedded Enterprise Chipsets (SR5690/SP5100, SR5670/SP5100, SR5650/SP5100) are compatible with all AMD embedded processors including high performance AMD Opteron™ processors, socketed AM2 low power single and dual-core AMD Athlon™ processors and very low power AMD Athlon, AMD Sempron™ and AMD Turion™ ASB1 (BGA) processors. In addition two I/O bridges can be used in the same system in any combination (SR5690/SR5690, SR5690/SR5670, etc). This level of flexibility helps you to design a solution that best fits your performance, power and I/O needs and with pin and socket compatibility in each processor package type, one design can meet a wide range of performance and power points. Power Efficiency Power and thermal design are important to all embedded enterprise applications. Consequently, the AMD Embedded Enterprise Chipsets are designed with power in mind. The SR5690/SR5670/SR5650 and SP5100 support both low power and high Tcase, allowing them to be used in compact designs. SR5650 SR5670 SR5690 SP5100 TDP 12.6W 15.4W 18W 4W Idle power 7.3W 7.6W 8W 1W Idle power (w/ C1E) 5.4W 5.75W 6.15W N/A Tcase 95 C 95 C 95 C 105ºC º º º ©2009 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, ATI, the ATI logo, AMD Athlon, AMD Opteron, AMD Turion, AMD Sempron, AMD Phenom and combinations thereof, are trademarks of Advanced Micro Devices. HyperTransport is a licensed trademark of the HyperTransport Technology Consortium. Windows, Window Vista and DirectX are registered trademarks of Microsoft Corporation in the U.S. and/or other jurisdictions. Linux is a registered trademark of Linus Torvalds. Other names are for informational purposes only and may be trademarks of their respective owners.

A New Platform Embedded Chipset Offering Flexibility and Reliability for Today’s Enterprise Applications Primary Solution Features > IDE Interface Processor Support > Embedded AMD OpteronTM Processors > Embedded AMD AthlonTM Single and Dual-Core Processors from 8W to 35W o Both AM2 and ASB1 packages > Embedded AMD TurionTM Processors > Embedded AMD SempronTM Processors > High Definition Audio o Unified Audio Architecture compatible o Four independent streams > SMBus 2.0 > LPC Bus I/O Bridge o Support for TPM version 1.1/1.2 devices o Supports SPI devices > HyperTransportTM 3 Technology o 5.2GT/s...