X-Mill

X-Mill

X-Mill

Product catalog summary
Overview: The X-MillTM is a mechanical milling instrument designed for sample preparation and physical failure analysis, particularly in complex integrated circuits and packages. It offers advanced technology for backside device thinning, stacked die package deprocessing, multi-chip module preparation, pre-chemical decapsulation, and substrate delayering.
Key Features:
  • Backside Thinning: Utilizes FIB/Laser/Photon/SIMS for precise thinning.
  • Automatic Sample Leveling: Features a motorized, dual-axis leveling stage to correct mounting errors and ensure planarity.
  • Intuitive Operation: Includes a navigation wizard for easy use, even for infrequent users, ensuring all processing parameters are addressed.
  • Z-Axis Control Modes: Offers Force Mode and Position Mode to maintain z-position and prevent sample damage.
  • 3D Thinning and Delayering: Capable of 3D machining to handle warped or bowed substrates.
Operation and Specifications:
  • Display: 12” Color LCD touch-screen with a wizard-guided GUI.
  • Camera: Color CCD camera with 640 x 480 resolution.
  • Spindle: Variable RPM from 5,000 to 100,000, with pneumatic tool change and precision ceramic bearings.
  • X & Y Control: Offers various tool patterns and adjustable tool index/overlap.
  • Z-Axis Control: Provides high resolution with force and position modes.
  • Automated Sample Leveling: Closed-loop, dual-axis system for precise leveling.
Additional Information: The X-MillTM is a registered trademark of Allied High Tech Products Inc., which reserves the right to improve product performance.
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Catalog excerpts

X-Mill-1

Product Summary The X-MillTM is a mechanical milling instrument, featuring state-of-theDUW WHFKQRORJ\ WR SUHFLVHO\ DQG HI¿FLHQWO\ SUHSDUH VDPSOHV IRU HOHFWULFDO and physical failure analysis applications. This easy-to-use and highly YHUVDWLOH V\VWHP PLOOV WKH ³WUXH´ SK\VLFDO SUR¿OH QHHGHG WR VXSSRUW WKH analysis of complex integrated circuits and packages. Backside Thinning Backside Device Thinning: FIB/Laser/Photon/SIMS Stacked Die Package Deprocessing Multi-Chip Module Preparation Pre-Chemical Decapsulation Package Substrate Delayering Frontside Circuit Delayering Multi-Chip Module Preparation Advancing Technology In Sample Preparation Advancing Technology In Sample Preparation

 Open the catalog to page 1
X-Mill-2

Intuitive Operation features an easy-to-use navigation wizard that helps even the infrequent user obtain expert results. 7KH ;0LOO IHDWXUHV D *8, WKDW JXLGHV WKH XVHU HI¿FLHQWO\ WKURXJK D VHTXHQFH RI VFUHHQV WR VHWXS WKH processing parameters, ensuring nothing is forgotten or overlooked prior to operation. 8VHUGH¿QDEOH SDUDPHWHUV LQFOXGH PLOOLQJ UHJLRQ OHYHOLQJ WROHUDQFH WRRO SDWWHUQ RYHUODS QRWFKLQJ WRRO W\SH GLDPHWHU ;< WUDYHO UDWH = GHSWK LQFUHPHQW )RUFH DQG 530 ZLWK DGGLWLRQDO KHOS VFUHHQV DW every process step. All of the parameters can then be easily stored in a memory location or on a...

 Open the catalog to page 2
X-Mill-3

Z-Axis Control Modes LV WKH RQO\ LQVWUXPHQW RI LWV NLQG WR RIIHU WZR PRGHV RI SUHFLVLRQ =FRQWURO Force Mode and Position Mode. ,Q IRUFH PRGH D XVHUGH¿QHG DPRXQW RI IRUFH LV DSSOLHG FRQWLQXRXVO\ ZLWK D =OLPLW WR SUHYHQW RYHUVKRRWLQJ WKH GHVLUHG WDUJHW GHSWK 8QOLNH ÀRDWLQJ KHDG RU OHDG VFUHZ EDVHG V\VWHPV WRRO SRVLWLRQ LV PDLQWDLQHG electronically to absorb and dampen vibration, eliminate tool chatter and prevent sample cracking. ,Q SRVLWLRQ PRGH WKH WRRO DXWRPDWLFDOO\ LQGH[HV IROORZLQJ D XVHUGH¿QHG LQFUHPHQW WR WKH ¿QDO WDUJHW This mode enables the tool to maintain z-position (even off the sample)...

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X-Mill-4

;0LOO 7HFKQLFDO 6SHFL¿FDWLRQV X & Y Control Operation • &ORVHGORRS VHUYRFRQWURO P UHVROXWLRQ • 12” Color LCD touch-screen • 0XOWLSOH PLOOLQJ SDWWHUQ RSWLRQV /HIWWR5LJKW • Wizard-guided GUI, requires no external PC Front-to-Back, Inside/Out Spiral, Cross-combo • Color CCD camera - 640 x 480 • 6HOHFWDEOH ;< UDWH PPV WR PPV • Store and Recall of Steps & Sequences on • Adjustable tool index/overlap removable CF card • ;< WUDYHO PP [ PP PLOOLQJ UHJLRQ Spindle Z-Axis Control • Variable spindle RPM: 5,000 – 100,000 • &ORVHGORRS P DFFXUDF\ QP • Pneumatic tool change, 3 mm collet resolution • Precision...

 Open the catalog to page 4

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.