THE MUltIPREP SYStEM
12Pages

PRECISION CROSS-SECTIONING UNEQUALLED RESULTS IN ALL OF THESE SAMPLE PREPARATION APPLICATIONS TEM WEDGE/ PLAN-VIEW POLISHING PARALLEL DELAYERING BACKSIDE POLISHING PRE-FIB THINNING

The MultiPrep™ System The MultiPrep™ System enables precise semi-automatic sample preparation of a wide range of materials for microscopic (optical, SEM, TEM, AFM, etc.) evaluation. Capabilities include parallel polishing, precise angle polishing, sitespecific polishing or any combination thereof. It provides reproducible sample results by eliminating inconsistencies between users, regardless of their skill. The MultiPrep™ eliminates the need for hand-held polishing jigs, and ensures that only the sample makes contact with the abrasive. The TechPrep™ polishing machine provides the power...

OSCILLATION The sample may be oscillated across the platen in an adjustable range, utilizing the entire abrasive surface. This function has six speed settings. SAMPLE ROTATION The sample can be rotated 360°, or limited to a back and forth rotation within a range of 30330°. Rotation provides a uniform abrasive pattern and prevents trails, smearing, and uneven abrasive distribution. Both functions have eight speed settings. LED DISPLAY and TIMER The LED displays the amount of time elapsed during operation. A preset time limit can be programmed, automatically shutting off the machine when the...

PRECISION CROSS-SECTIONING The MultiPrep is an excellent tool for precision cross-sectioning a wide variety of materials. Applications that take advantage of its speed, precision, and accuracy include failure analysis, yield analysis, quality control, and research & development. With feature size of certain samples becoming smaller, such as in the electronics industry, it is critical to control the material removal rate to avoid polishing through the area of interest. The MultiPrep provides consistent sample rotation, oscillation and load, assuring uniform material removal. The digital dial...

TEM WEDGE /PLAN-VIEW POLISHING The MultiPrep is an efficient tool for preparing materials for TEM observation in either wedge or plan-view format. Samples are reliably polished to electron transparency, often eliminating the need for ion milling. Consistent sample rotation, oscillation and load provide uniform material removal and eliminate artifacts that can be associated with manual polishing. The dial indicator measures the sample and allows the operator to monitor its thickness throughout the polishing process, decreasing preparation time by eliminating the guesswork associated with...

PARALLEL DELAYERING The MultiPrep is ideal for parallel polishing. The most common application is for IC delayering, but it is also used to thin PCB’s, substrates, compound semiconductor wafers, optics, geological specimens and other materials. Parallel delayering of IC’s is a useful technique for construction or failure analysis. The MultiPrep allows precise, semiautomatic polishing, eliminating the tedious function of finger polishing or hand-holding polishing tools. Mechanical polishing on the MultiPrep provides controlled material removal, and eliminates the risks associated with...

BACKSIDE POLISHING When thinning electronic devices for various analysis including SIMS, LSM, Backside Emission Microscopy, and related NIR techniques, it is important to achieve a flat, highly polished surface. The MultiPrep automatically indexes samples into the abrasive, eliminating the need to hand-hold polishing jigs. This allows for unattended sample preparation, enabling the user to perform other lab tasks simultaneously. IC’s or packages such as flip chip, DIP, BGA, or PBGA can be prepared, maintaining electrical properties necessary for fault isolation and analysis. Even packages...

PRE-FIB THINNING Since FIB (Focused Ion Beam) time is valuable, a pre-thinned sample decreases milling time, which increases sample throughput and reduces cost of ownership. The MultiPrep system accurately thins samples prior to using a FIB system for cross-section SEM or TEM sample preparation. It allows semiautomatic sample thinning with excellent reproducibility, and can prepare one or more samples simultaneously. Samples are typically thinned to a final thickness of 5-20 microns, depending on operator preference. In addition, if one side can be cleaved to within several microns of the...

MULTIPREP ™ SYSTEM AND ACCESSORIES Item No. MultiPrep™ System Includes: MultiPrep™ positioning device, TechPrep™polishing machine, 8" platen and dial indicator calibration kit. 115V AC/60 Hz/1 Phase MultiPrep™ System with 220V AC/50 Hz/1 Phase Cam-Lock Adapter Used to hold IC’s or other unencapsulated samples Used for TEM wedge/plan-view polishing, and Pre-FIB thinning Cross-Sectioning Paddle TEM/Pre-FIB Thinning Fixture w/ Pyrex inserts, Heating/Mounting Stage TEM/FIB Thinning Fixture SIMS/Backside Pyrex Holder Used for sample thinning Parallel Polishing Fixture Used when polishing samples...

12" MultiPrep™ Polishing System The MultiPrep™ System enables precise semiautomatic sample preparation of a wide range of materials for microscopic (optical, SEM, TEM, AFM, etc.) evaluation. Capabilities include parallel polishing, precise angle polishing, site-specific polishing or any combination thereof. It provides reproducible sample results by eliminating inconsistencies between users, regardless of their skill. The MultiPrep eliminates the need for hand-held polishing jigs, and ensures that only the sample makes contact with the abrasive. It maintains geometric orientation of the...

TechCut 5™ Precision Sectioning Machine A versatile, programmable precision sectioning saw designed to cut a wide variety and size of materials. The TechCut 5™ automatically sections materials at high speeds, increasing sample throughput. The microprocessor based system allows a stepper motor to control sample feed-rate, distance and force, and automatically adjusts feed rate as the cutting condition changes due to varying thickness and/or material differences in the sample. Cutting depth is programmable, and when sectioning is complete, the table automatically retracts the sample to the...