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S-3 HDI? Yarn

S-3 HDI? Yarn
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PRODUCT INFORMATION S-3 HDI™ Yarn Low CTE, High Modulus Glass Fiber Yarn for IC Substrate PCB Applications AGY’s S-3 HDI™ yarns are specically designed to meet the demanding performance requirements of IC substrate PCBs. Product Application The use of smartphones and tablet PCs continues to grow globally. In addition, the functionality of these devices continues to increase, which has created the need for smaller and highly specialized PCBs. IC substrates are utilized as the connection between the IC chips and the PCB, and represent state-of-the-art miniaturization in PCB design. Often referred to as chip scale package, package-on-package, or multi-chip package solutions, these PCBs are routinely found in smartphones and tablet PCs. Product Description S-3 HDI yarns are produced using a proprietary, patent pending glass CTE = 3.5 ppm/OC vs. 5.4 ppm/OC for E-Glass Minimizes CTE mismatch with silicon chips, improving substrate reliability Tensile Modulus = 86 GPa vs. 72 GPa for E-Glass Enables thin substrates with minimum warpage at elevated temperatures Excellent conductive anodic lamentation (CAF) resistance Wide range of ber micronage and yield/tex Wide range of possible substrate thicknesses Highly homogeneous glass quality Consistent performance in PCB applications Treated with electronics grade starch/ oil sizing Fabric surface smoothness with high-speed air-jet weaving composition designed for the specic requirements of low coefcient of thermal expansion (CTE) and high tensile modulus. S-3 HDI yarns are available in a wide range of ber micronage and yield/tex, including ultra-ne yarns for the thinnest substrates.

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PRODUCT INFORMATION PROPERTIES AGY has been a provider of ne yarns to the electronics industry for a signicant number of years and using the experience gained has now a range of ne, extra ne as well as ultrane yarns to meet the demands of the printed circuit board industry. Today AGY offers E-Glass yarns into a number of fabric styles and weights, from fabrics used in desktop computers to light weight fabrics used in mobile devices used today and tomorrow. Dissipation Factor, Tan ∂, (Df) Density Softening Point Coefficent of Thermal Expansion Tensile Load to Failure (D450 fiber) Tensile...

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