Compact Fanless System with 6th/7th Gen Intel® Core™ i CPU Socket (LGA 1151) Features Intel® 6th/7th Gen Core™ i CPU socket-type (LGA1151) with Intel® Q170/ H110 chipset Wide operating temperature (-10 ~ 50 °C) VGA and DVI output 2 x GigaLAN and 8 x USB 3.0 2 x RS-232/422/485 and 4 x RS232 serial ports 1 x 2.5" HDD/SSD, 1 x CFast, and 1 x mSATA 9 ~ 36 VDC input power range Supports FlexIO and iDoor technology, flexible configure additional HDMI, DVI, DIO, Remote switch IO Supports Advantech i-Modules Supports Advantech SUSIAccess and embedded software APIs UL ® Specifications 6th/7th Generation Processor* (TDP 35W) CPU Core Number Base Frequency Max Turbo Frequency L3 Cache Temperature Chipset BIOS CPU Core Number Base Frequency Max Turbo Frequency L3 Cache Temperature Chipset BIOS Technology Socket Maximum Capacity Chipset Controller Interface HDD CFast mSATA RAID SATA Conn. USB Expansion LED and Switch Power Serial Port Audio Module Mini PCIe LED Button Type Input Voltage Power consumption Watchdog Timer Output Interval Temperature Humidity Vibration Mechanical Certications Shock Dimensions (W x H x D) Weight Installation EMC Safety i7-6700TE i5-6500TE i3-6100TE G4400TE 4 4 2 2 2.4 GHz 2.3 GHz 2.7 GHz 2.9 GHz 3.4 GHz 3.3 GHz 8 MB 6 MB 4 MB 3 MB -10 ~ 50 °C (w/ industrial SSD, 0.7 m/s air flow) Q170/H110 AMI 128Mb SPI Flash I5-7500 I3-7101E I5-6500 I3-6100 4 2 4 2 3.4 GHz 3.9 GHz 3.2 GHz 3.7 GHz 4.0GHz 3.6GHz 6 MB 3 MB 6 MB 4 MB -10 ~ 40 °C (w/ industrial SSD, 0.7 m/s air flow) Q170/H110 AMI 128Mb SPI Flash Dual-channel DDR4 2133/2400 MHz (without ECC) 2 x 260-pin DDR4 SODIMM (up to 16 GB per socket) 32GB 7th Gen. CPU: Intel HD Graphics 630, supports DirectX 12 6th Gen. CPU: Intel HD Graphics 530/510, supports DirectX 12 1 x DB15, up to 2048 x 1152 maximum resolution 1 x DVI, up to 1920 x 1080 maximum resolution @ 30Mhz (with optional expansion cable for second DVI connector, or 1 x HDMI connector) Q170: 3 x independent displays (third display output via optional cable) H110: 2 x independent displays Q170 LAN1: Intel® I219LM, LAN2: Intel® i210IT H110 LAN1: Intel® I219V, LAN2: Intel® i210IT 2 x RJ45 1 x 2.5" HDD/SSD 1 1 0/1/5/10 (MIC-7700Q only) Q170: 3 x SATA signal, 3 x SATA power H110: 1 x SATA signal, 1x SATA power Q170: 8 x USB 3.0 and 1 x internal USB 2.0 H110: 4 x USB 3.0 and 4 x USB 2.0 2 x DB9, 2 x RS-232/422/485 support auto flow control; 4 x RS-232 (with expansion cable) 2 (1 x line out and 1 x mic in) Supports Advantech i-Modules Q170: 1 x mini PCIe (via USIM), 1 x mini PCIe/mSATA H110: 1 x mini PCIe (via USIM), 1 x mSATA 2 (1 x Storage and 1 x Power), 4 for COM1 TX/RX and COM2 TX/RX 1 x Power on/off switch ATX/AT 9 ~ 36 VDC Typical: 32.062W Maximum: 116.002W System reset Programmable 1 ~ 255 sec/min 65W CPU w/ industrial SSD 35W CPU w/ industrial SSD Non-operating -10 ~ 40 °C with 0.7 m/s air flow -10 ~ 50 °C with 0.7 m/s air flow -40 ~ 85 °C 95% @ 40 °C (non-condensing) With SSD: 3 Grms @ 5 ~ 500 Hz, random, 1 hr/axis 2G With 2.5" HDD: 1 Grms @ 5 ~ 500 Hz, random, 1 hr/axis With SSD: 20G, IEC-68-2-27, half-sine wave, 11 ms duration 50G 11 ms 77 x 192 x 230 mm (3.07" x 7.55" x 9.05") 2.8 kg (6.17 lbs) Desktop/wall mount CE/FCC Class A, CCC, BSMI UL, CCC, BSMI 7th Gen. CPU: Windows 10, Windows 10 IoT 6th Gen. CPU: Windows 10, Windows 10 IoT, Windows 8 .1 (64 bit), Windows 7 MIC-7700Q: Windows Server 2016 Linux OS Modular IPCs All product specifications are subject to change wit

Front View Side View LAN1/2 COM 1/2 COM1 TX/RX Line Out USB 3.0/2.0 COM2 TX/RX Mic In iDoor or 2 x RS-232 expansion slots Description MIC-7700 bare system Driver CD Startup manual EN\CN\TC for MIC-7700 1st Ed 4-pin Phoenix power connector Mounting bracket SATA cable SATA power cable Dual DB9 port cable (for COM5/COM6 expansion) CPU thermal grease RAM thermal pad PCIe i-Module (optional) i-Module (optional)* Description 4-slot expansion module (4 x PCIe slots) 4-slot expansion module (1 x PCIe and 3 x PCI slots) 2-slot expansion module (2 x PCIe slots) 2-slot expansion module (2 x PCIe slots)...