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Test Point Pin

Test Point Pin

Product catalog summary
Overview: Advanced Interconnections provides a range of standard and custom Test Point Pins designed for durability and efficiency in assembly processes. These pins are screw-machined, offering advantages over traditional stamped-and-formed products.
Specifications: The Test Point Pins are precision-machined from Brass Copper Alloy and can be plated with Matte Tin or Gold over Nickel for RoHS compliance, or Tin/Lead over Nickel for exempt applications. They are available with Sn/Pb or Sn/Ag/Cu solder preforms.
Features:
  • Unique rounded terminal head reduces the risk of pinprick injuries during assembly.
  • Available in loose form or packaged in tape and reel for automated insertion, with 300 pins per reel.
  • Custom design options include unique solder preforms and tape and reel packaging.
Procedures: In intrusive reflow applications, the solder preform eliminates the need for wave or hand soldering, providing a strong thru-hole connection without additional board processing. Solder paste is applied over the PCB hole (tenting), and the test pin with preform is placed into the hole. The flux in the solder paste activates the solder preform during reflow.
Applications: These Test Point Pins are suitable for surface mount PC boards and can be custom designed to meet specific requirements, reducing overall system costs.
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Catalog excerpts

Test Point Pin-1

RoHS Compliant Pb Free www.advanced.com Advanced Interconnections offers a wide variety of standard and custom terminals for use as Test Point Pins. The screw-machined pins offer superior durability over stamped-and-formed products while reducing assembly time and safety concerns. As with all products from Advanced, unique features and value-added services are available to help reduce overall system costs. Custom design options include unique solder preforms and tape and reel packaging. When used in an intrusive reflow application, the solder preform eliminates the need for wave or hand soldering, providing the strength of a thru-hole connection point without the need for additional board processing in surface mount (SMT) applications. ► Solder paste is applied over the PC board hole in an operation called tenting. ► The test pin with preform is placed into the "tented" hole. ► Flux in the solder paste activates the solder preform. ■ Unique rounded terminal head significantly reduces the potential for pinprick injuries to employees' fingers during assembly and subsequent board handling, compared to traditional sharp-pointed .025 inch square-post test pins ■ Available loose or individually packaged in tape and reel pockets to facilitate automated insertion (300 pins per reel) ■ When used on surface mount PC boards, Test Pins with unique solder preforms are available (see How it Works for intrusive reflow application) ■ Precision-machined from Brass Copper Alloy and plated with either Matte Tin or Gold over Nickel for RoHS compliant applications or Tin/Lead over Nickel for exempt applications ■ Available with Sn/Pb or Sn/Ag/Cu solder preforms ■ Custom designed to your specifications S5 Energy Way, West Warwick, Rhode Island 02893 USA Tel: 800.424.9850 | 401.823.5200 | Fax: 401.823.8723 . INTERCONNECTIONS. E-mail: [email protected] | Web: www.advanced.com © 2007, Advanced Interconnections Corp. Specifications subject to change without notice. Products shown may be covered by patents issued and/or pending. Item TESTPIN-TECH07 (Rev. 0)

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.