Peel-A-Way® DIP Socket

Product catalog summary

Specifications:
The document outlines the specifications for DIP Socket Terminal Carriers, including materials such as Brass (Copper Alloy C36000) and Beryllium Copper (Copper Alloy C17200). Solder preforms are available in standard (63Sn/37Pb) and lead-free (95.5Sn/4.0Ag/0.5Cu) compositions. Plating options include Gold, Matte Tin, and Tin/Lead, each compliant with specific ASTM and MIL standards.

Features:
Key features of the Peel-A-Way® DIP Socket Terminal Carriers include a disposable carrier that can be peeled away after soldering, allowing for complete soldering visibility on both sides of the PCB. This design enhances air flow and flux rinse, and prevents contact damage during insertion and extraction.

Ordering Information:
The document provides a guide on how to order, specifying body type, terminal type, DIP spacing, number of pins, and plating options. RoHS compliance is noted for certain materials and finishes.

Material and Usage:
The carriers are made from Polyimide Film, suitable for temperatures ranging from -269°C to 400°C. The document also describes the process of using the socket, which involves placing it on the PCB, soldering, and then peeling away the film for inspection.

Dimensional Information:
Detailed dimensions for various terminal types and configurations are provided, including low profile and ultra-low profile options. The document includes a table of models with specific measurements for different pin counts and spacing.

Additional Information:
The document mentions the availability of RoHS Qualification Test Reports and CAD Drawings online. It also highlights the EXPRESS delivery option for certain terminals, indicating fast lead times with some restrictions.

Catalog excerpts

Peel-A-Way DIP Socket Terminal Carriers Table of Models Description: Peel-A-Way® Socket (KS) Material: Polyimide Film Index: -269°C to 400°C (-452°F to 752°F) Polyimide Film For molded insulators, see pages 28-29. Options Tape Seal - add 3M to end of part number • Removable tape seal protects plated contact in harsh environments • Sealed socket will not allow dirt and other contaminants to enter socket chamber and become entrapped behind contact fingers Features: • Peel away terminal carrier after soldering. • Disposable carrier. (shown here on molded socket) • Complete soldering visibility on both sides of PCB. • Spray flux without contaminating contact area Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F) Intermittent to 371°C (700°F) • Maximum air flow. • Better flux rinse. • No contact damage due to terminal carrier insertion. Solder Preform Terminals Tin/Lead: Type -151 Lead-free: Type -812 • No contact pull out due to extraction of terminal carrier. Specifications: Terminals: Brass - Copper Alloy (C36000) ASTM-B-16 Contacts: Beryllium Copper - Copper Alloy (C17200) ASTM-B-194 Solder Preform: Standard: 63Sn/37Pb Lead-free: 95.5Sn/4.0Ag/0.5Cu See pg. 29 for intrusive reflow application. Tin/Lead: Type -150 Lead-free: Type -811 Solder Preform Tin/Lead: Type -111 Lead-free: Type -810 Peel-A-Way® only Body Type Gold per ASTM-B-488 Matte Tin per ASTM545-97 Tin/Lead per MIL-P-81728 Nickel per QQ-N-290 RoHS Compliant: Plating: G - Gold over Nickel M - Matte Tin over Nickel T - Tin/Lead over Nickel RoHS Compliant Insulators: DIP Spacing 3 - .300/(7.62mm) 4 - .400/(10.16mm) 6 - .600/(15.24mm) 9 - .900/(22.86mm) Number of Pins (8 to 64) Additional sizes available - consult factory. Terminal Plating RoHS Compliant: G - Gold M - Matte Tin T - Tin/Lead Terminal Type See options on next page Note: Terminals plated with Matte Tin are available only with Gold plated contacts. 5 Energy Way, West Warwick, RI 02893 USA Tel: 800.424.9850 | 401.823.5200 Fax: 401.823.8723 [email protected] | www.advanced.com Catalog 16A Products shown covered by patents issued and/or pending. Specifications subject to cha

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Peel-A-Way® DIP Socket Terminal Carriers DIP Sockets Standard Terminals Additional standard and custom terminals available. See Terminals section or consult factory. Note: Terminals shown with insulator removed. Polyimide Film Peel away after soldering to PCB. V Dimensional Information )t Surface Mount Options Available Solder fillets visible both sides for inspection and cleaning. 1. Place socket on PC board. 2. Send PC board and socket through soldering operation. 3. Peel away polyimide film carrier for complete solder joint visibility or leave in place for added stability. Available Online: RoHS...

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Peel-A-Way® DIP Socket

Peel-A-Way® DIP Socket

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