Mod5 Series Flip-Top™
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The Mod5 Series Flip-Top™ BGA Socket is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact design requires no tooling or mounting holes in the target PC board, maximizing real estate while reducing board costs. Flip-Top™ BGA Socket provides a surface mount test solution for micro-BGA chipsets used in applications such as handheld, mobile, and wireless product development. Precision machined spring probes with industry proven solder balls ensure high reliability performance. ► Solder lower assembly to PC board ► Attach upper assembly using four supplied screws. ► Insert BGA device by hand or with the aid of a vacuum pen (recommended). ► Place device-specific chip support plate (supplied) over device, close lid, and screw down heat sink actuator for device engagement. ■ Model shown accommodates BGA packages up to 12mm sq. (22 x 22 rows) - larger sizes available upon request ■ Precision machined spring probes offer high bandwidth with very low insertion loss Compact size (small keepout zone) enables use on existing board layouts ■ Flip-Top BGA Socket's easy actuation with simple cover and turn-screw heat sink enables quick insertion and extraction ■ SMT design eliminates the cost of hardware and mounting holes and their associated interference with traces on the PCB ■ Modular design of lower assembly enables simple reflow process and is compatible with lead-free reflow profiles ■ Metallic probes offer proven reliability over elastomeric sockets and long-life (spring probe contact system life is 200,000 cycles minimum) ■ Additional mounting options and custom designs available ADVANCEDINTERCONNECTIONS. 5 Energy Way, West Warwick, Rhode Island 02893 USA Tel: 800.424.9850 | 401.823.5200 | Fax: 401.823.8723 E-mail: info@advanced.com | Web: www.advanced.com © 2010-2016, Advanced Interconnections Corp. Specs. subject to change without notice. inch/(mm)

An RoHS Compliant Pb Free www.advanced.com Performance Table of Models Durability Actuation cycles: 500 minimum Current Carrying Capacity 2.8 Amps Max. Probe Contact Force 18 g (per position) Probe Contact Resistance 80 mOhms Complete SI Simulation Report available online MOUNTING OPTIONS MOUNTING/TERMINAL TYPE DESIGNATION or—id Bottom View Terminal Type -860 Sn/Ag/Cu Solder Ball Terminal Type -861 Sn/Pb Solder Ball ■ Note 1: See Application Spec. for recommended adhesive (epoxy) instructions* Terminal Type -864 Sn/Ag/Cu Solder Ball Terminal Type -865 Sn/Pb Solder Ball ■ Note 2: Screws...