Click on a product group below for more info >> BGA Socketing Systems << View our Product Catalog Peel-A-Way® Carriers PGA Sockets by clicking on the bookmarks on the left side of the window To SEARCH our catalog in Acrobat®, in the top menu options, select EDIT>SEARCH. You will see a popup window appear. Visit our Web Site, www.advanced.com Look up products, documentation, check stock, download CAD files, find sales reps and more! SIP Adapters Board to Board Connectors Adapters Terminals BGA Footprints* Reference Advanced Interconnections Corp. 5 Energy Way West Warwick, RI 02893 Tel: 800-424-9850 401-823-5200 Fax: 401-823-8723 [email protected] *In order to keep the Catalog PDF to a manageable download size the BGA Footprints have been removed but can be downloaded as a separate file by clicking on the name to the right in red.

T h e A dva nce d ® D i f fere nce Pe e l - A - Wa y ® R e m o va b le Term i n a l C arriers Advanced Interconnections is a leading designer and manufacturer of innovative interconnect solutions for electronic applications worldwide. Founded in 1982, Advanced specializes in IC sockets, adapters and PC board connectors with technologically advanced features and benefits. Our products feature the highest quality screw-machined terminals with multi-finger contacts. Standard and custom designs are available for thru-hole and surface mount applications. A variety of insulator and plating materials...

Catalog Cover Our Ball Grid Array Socket Adapter Systems and Flip-TopTM BGA Socket offer a reliable method for socketing BGA, LGA, and CSP devices in validation, test and production applications. ■ Compact designs match IC device footprint. Patented solder ball terminals offer process yields equivalent to direct device attach. Available in tape and reel packaging for automated assembly. Advanced Interconnections is a leading designer and manufacturer of innovative interconnect solutions for electronic applications worldwide. Founded in 1982, Advanced specializes in IC sockets, adapters and PC...

www.advanced.com Please visit our web site at www.advanced.com for the latest product updates and access to test data, electrical performance, technical specifications, CAD drawings and more. In addition to products presented in this catalog and on our web site, we offer a wide variety of custom interconnect solutions. Please contact our experienced application engineers, manufacturer’s representatives, and worldwide network of authorized distributors for standard and custom interconnect solutions to meet your application requirements. Advanced proudly manufactures in the USA from our 35,000...

Table of Contents BGA Socketing Systems Designed for use with Ball Grid Array (BGA), Land Grid Array (LGA), and Chip Scale Package (CSP) devices in development, test and production applications. Over 1,000 footprints available online in our searchable BGA Socket Finder™ database at www.bgasockets.com. Fine Pitch BGA Socket Adapter System (0.50mm, 0.65mm) . . . . . . . . . . . . . . . . . . . . . . 4 Ball Grid Array (BGA) Adapters (0.80mm, 1.00mm, 1.27mm) . . . . . . . . . . . . . . . . . . . . . . 6 Ball Grid Array (BGA) Adapter Sockets (0.80mm, 1.00mm, 1.27mm) . . . . . . . . . . . . . . . 8...

SIP Sockets & Adapters High quality sockets and adapters for Single Inline Packages (SIP) and Board to Board applications on .100/(2.54mm) pitch featuring industry’s most reliable screw-machined terminals with multi-finger contacts. Available in new high temperature molded LCP (liquid crystal polymer) and our patented Peel-A-Way® insulators. SIP Sockets - Molded and Peel-A-Way Insulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 ® SIP Adapters - Molded and Peel-A-Way Insulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 ® Board to Board...

BGA Socket Adapter System Fine Pitch BGA Socket Adapter System 0.50mm and 0.65mm Pitch Table of Models Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board Index: -40°C to 140°C (-40°F to 284°F) Note: Mates with Standard Socket for BGA device socketing. Description: SMT Adapter (A) Material: FR-4 Fiberglass Epoxy Board Index: -40°C to 140°C (-40°F to 284°F) Note: Mates with Standard Socket for LGA Socketing or Board to Board applications. • Advanced’s field-proven screwmachined terminals with multifinger contacts, arranged in an interstitial male/female pin pattern are gold...

Fine Pitch BGA Socket Adapter System BGA Socket Adapter System 0.50mm and 0.65mm Pitch Standard Terminals Type -834 Tin/Lead: Type -832 Lead-free: Type -833 Standard Adapter Standard Socket Note: Solder ball diameter is 0.012/(0.30mm) on 0.50mm pitch models and 0.014/(0.36mm) on 0.65mm pitch models. See page 15 for Generic Reflow Profiles. 180 Pins Footprint Number 180-2 .394 Sq. (10.00) • Adapter matches footprint of BGA/LGA device and plugs into mating socket using unique male/female terminals in an interstitial pattern (patented design). • Socket matches footprint of BGA/LGA device. Use alignment...

Ball Grid Array (BGA) Adapters For use with BGA Sockets on pages 8-9 Table of Models • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Insulator Size: BGA device body +.079/(2.00mm) Description: Extraction Slot Adapter (AX) Material: FR-4 Fiberglass Epoxy Board Index: -40°C to 140°C (-40°F to 284°F) Note: Mates with Extraction Socket (SB) Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board Index: -40°C to 140°C (-40°F to 284°F) Note: Mates with Standard Socket (S) Insulator Size: BGA...

Ball Grid Array (BGA) Adapters For use with BGA Sockets on pages 8-9 Additional standard and custom terminals available. See Terminals section or consult factory. Standard Terminals Type -638 Tin/Lead: Type -720 Lead-free: Type -823 See page 15 for Generic Reflow Profiles. Reflow (solder) BGA Device to Adapter Reflow (solder) Socket to PCB (See pgs. 8-9 for sockets) • Either Tin/Lead or Lead-free device packages can be attached to our RoHS Compliant Adapters. • PC boards can be processed with Tin/Lead BGA sockets in standard profiles or lead-free BGA sockets in RoHS Compliant, high temperature...