Flip-Top™ BGA Sockets 1.27mm and 1.00mm Pitch Table of Models Description: Socket (FRG, 1.27mm pitch) Guide Box and Base Mat’l: High Temp. Liquid Crystal Polymer (LCP) Index: -40°C to 260°C (-40°F to 500°F) Socket Size: 3.00mm wider and 10.00mm longer than BGA device (for packages larger than 15.00mm square).* Description: Socket (FRH, 1.00mm pitch) Guide Box Mat’l: High Temp. Liquid Crystal Polymer (LCP) Index: -40°C to 260°C (-40°F to 500°F) Base Mat’l: FR-4 Glass Filled Epoxy Index: -40°C to 140°C (-40°F to 284°F) Socket Size: 3.00mm wider and 10.00mm longer than BGA device (for packages larger than 15.00mm square).* Features: • Designed to save space on new and existing PC boards in test, development, programming and production applications. • No external hold-downs or soldering of BGA device required. • AIC exclusive solder ball terminals offer superior processing. • Uses same footprint as BGA device • Available with integral, finned heat sink or coin screw clamp assembly. FRG replaces FTG. * For device packages smaller than 15.00mm square, the socket size is X = .709/(18.00) and Y = .984/(25.00). How It Works Specifications: Terminals: Brass - Copper Alloy (C36000) ASTM-B-16 SMT models are shipped un-assembled to ease solderability. Thru-hole models are shipped fully assembled. 1. Lower assembly is soldered to PC board with no external hold-down mechanism. Thru-hole models may be soldered to PC board or plugged into a mating socket. 2. Upper assembly inserts easily to lower assembly by aligning guide posts and installing four (supplied) screws. 3. Finned heat sink or coin screw is screwed down to flush with bottom of lid. 4. Lid opens easily by pressing latch. 5. BGA device is inserted by aligning A1 position with chamfered corner of Flip-Top™ socket. Place support plate on top of device, close lid, engage heat sink or coin screw, and socket is ready for use. See page 15 for Generic Detailed Installation and General Usage Instructions are Reflow Profiles. provided with product. G - Gold over Nickel How To Order Terminal Support: Polyimide Film Spring Material: Stainless Steel Lid, Latch, Heat Sink/Coin Screw and Support Plate Material: Aluminum Footprint Dash # If Applicable* Model Type RoHS Compliant Insulator: FR - Flip-Top™ BGA Socket RoHS Compliant Pb Free T, Clamp Options HS - Heat Sink (3 Fins Std.) CS - Coin Screw Contact Plating RoHS Compliant: G - Gold Solder Ball: Standard: 63Sn/37Pb Lead-free: 95.5Sn/4.0Ag/0.5Cu | ADVANCEDL INTERCONNECTIONS Pitch G = .050/(1.27mm) H = .039/(1.00mm) Number of Positions *See footprints section or online database. Terminal Plating RoHS Compliant: G - Gold Terminal Type See options 5 Energy Way, West Warwick, RI 02893 USA Tel: 800.424.9850 | 401.823.5200 Fax: 401.823.8723 [email protected] | www.advanced.com Catalog 16A

Flip-Top BGA Sockets 1.27mm and 1.00mm Pitch Flip-Top™ BGA Sockets r i Terminals (for test, development and production applications) Thru-Hole_ SMT (Surface Mount) _Thru-Hole_ SMT (Surface Mount) _Thru-Hole_ SMT (Surface Mount) Terminals (for LGA or de-balled BGA device applications) Tin/Lead: Type -713 Tin/Lead: Type -762 Lead-free: Type -822 Lead-free: Type -838 Footprints: 360 Pins Footprint Number 360-2 .112 (2.84) Terminals (for BGA device test applications) Tin/Lead: Type -659 Tin/Lead: Type -TBD Lead-free: Type -820 Lead-free: Type -TBD Consult Factory Full grid molded...