BGA Data Book
12Pages

Test | Development | Validation | Production Micro-BGA Socketing System BGA Socket Adapter System Flip-Top™ BGA Socket BGA Interposer

BGA Socket Adapter Systems Micro-BGA Socket Adapter System 0.50mm and 0.65mm Pitch Table of Models Section Title Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board Note: Mates with Standard Socket for BGA device socketing. Description: SMT Adapter (A) Material: FR-4 Fiberglass Epoxy Board Note: Mates with Standard Socket for LGA Socketing or Board to Board applications. Features • Advanced’s field-proven screwmachined terminals with multi-finger contacts, arranged in an interstitial male/female pin pattern are gold plated for gold/gold interconnect. • Small overall size...

Adapter Systems Micro-BGA Socket Adapter System0.50mm and 0.65mm Pitch Standard TerminalsType -834 Note: Solder ball diameter is 0.012/(0.30mm) on 0.50mm pitch models and 0.014/(0.36mm) on 0.65mm pitch models. • Adapter matches footprint of BGA/LGA device and plugs into mating socket using unique male/female terminals in an interstitial pattern. • Socket matches footprint of BGA/LGA device. Use alignment pins to align Device/Adapter assembly during insertion into board-mounted Socket. • One extraction tool (P/N 8794) is supplied with each order. See page 15 for Generic Reflow Profiles....

BGA Socket Adapter Systems Ball Grid Array (BGA) Adapters 0.80mm, 1.00mm, and 1.27mm Pitch Table of Models Description: Standard Adapter (A) Material: FR-4 Fiberglass Epoxy Board Note: Mates with Standard Socket (S) Description: Extraction Slot Adapter (AX) Material: FR-4 Fiberglass Epoxy Board Note: Mates with Extraction Socket (SB) Features • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. • Uses same footprint as BGA device. • Custom adapters available for heat sink attachment. • Gold plated...

Ball Grid Array (BGA) Adapters For use with mating BGA Adapter Sockets Standard Terminals Consult factory for additional terminals. 0.80mm Pitch Type -700 Type -700 Tin/Lead: Type -720 Lead-free: Type -823 SMT (Surface Mount) BGA Socket Adapter Systems Tin/Lead: Type -737 Lead-free: Type -824 0.80mm pitch .020/(0.51) Dia. Solder Ball Tin/Lead: Type -736 Lead-free: Type -829 How It Works Device Adapter Reflow (solder) BGA device to adapter Reflow (solder) socket to PCB See page 15 for Generic Reflow Profiles. • Either Tin/Lead or Leadfree device packages can be attached to our RoHS Compliant...

Adapter Systems Ball Grid Array (BGA) Adapter Sockets 0.80mm, 1.00mm, and 1.27mm Pitch Features • Advanced® exclusive solder ball terminals offer superior SMT processing. • Same footprint as BGA device. • Proven long-term performance in vigorous temperature cycling applications - solder ball terminal absorbs TCE mismatch. • Closed bottom socket terminal for 100% anti-wicking of solder. • Gold contacts allow gold/gold interconnections to Adapter pins. • Low insertion force socket with multi-finger high reliability Beryllium Copper contacts. • Coplanarity consistently under .006 inch industry...

Ball Grid Array (BGA) Adapter Sockets BGA Socket Adapter Systems For use with mating BGA Adapters Standard Terminals Tin/Lead: Type -636 Lead-free: Type -819 Tin/Lead: Type -790 Lead-free: Type -788 Tin/Lead: Type -716 Lead-free: Type -816 Tin/Lead: Type -702 Lead-free: Type -828 Additional standard and custom terminals available. See Terminals section or consult factory. Reflow (solder) BGA device to adapter Reflow (solder) socket to PCB • Either Tin/Lead or Lead-free device packages can be attached to our RoHS Compliant Adapters. • PC boards can be processed with Tin/Lead BGA sockets in...

Flip-Top™ BGA Sockets 0.50mm Pitch Table of Models For Device Packages Up to 12 mm2 Description: SMT Standard (FRM) See Note 1 Note 1: See Application Spec. for recommended adhesive (epoxy) instructions. Description: SMT/Screw Mount (FRM) See Note 2 Height 0.68/(17.4mm)* approx. (*will vary based on reflow profile, paste volume, etc.) Note 2: Screws provided for additional strain relief when needed; reflow still required. Description: SMT Plus (FRM) Features • Model shown accommodates BGA packages up to 12mm sq. (22 x 22 rows) with larger sizes available upon request. • Precision machined...

#0-80 Screws (4 supplied) Chip Support Plate Turn-screw Heat Sink BGA Device (not supplied) Design your own BGA Adapter or Socket using our online tools or submit your device mechanical specs and we will provide the matching part numbers. Upper Assembly Lower Assembly Step 1: Solder lower assembly to PC board, apply epoxy if required. Step 2: Attach upper assembly using four supplied screws. Step 3: Insert BGA device by hand or with the aid of a vacuum pen (recommended). Step 4: Place device-specific chip support plate (supplied) over device, close lid, and screw down heat sink actuator for...

Flip-Top™ BGA Sockets 1.27mm and 1.00mm Pitch Table of Models Description: Socket (FRG, 1.27mm pitch) Material: Guide Box: Molded PPS Base: High Temp. Liquid Crystal Polymer (LCP) Description: Socket (FRH, 1.00mm pitch) Material: Guide Box: Molded PPS Base: FR-4 Glass Filled Epoxy Features • Designed to save space on new and existing PC boards in test, development, programming and production applications. • No external hold-downs or soldering of BGA device required. • AIC exclusive solder ball terminals offer superior processing. • Uses same footprint as BGA device. • Available with...

Terminals (for test, development and production applications) Thru-Hole_SMT (Surface Mount)_ _Thru-Hole_SMT (Surface Mount) 1.27mm pitch I .102 ^ (2.59) TT .206 (5.23) For details relating to proprietary information protected by patents, see Pat. www.advanced.com/patents. Specifications subject to change without notice. inch/(mm) Design your own BGA Adapter or Socket using our online tools or submit your device mechanical specs and we will provide the matching part numbers. BGA Footprint Finder • Thousands of footprints available online • Search by pitch, device size, etc. • Select matching...