B2B® High Density SMT Connectors

Product catalog summary

Overview: The document provides detailed specifications and features of B2B® SMT Board to Board Connectors, designed for high reliability and long-life applications. These connectors are known for their robust screw-machined terminals and multi-finger contacts, suitable for blind mating and rigorous cycles.

Specifications: The connectors feature a shrouded guide box design for alignment and protection, industry-standard footprints, and are precision molded in high-temperature LCP with polarization keying. They support 3 amps per pin, allowing more contacts for data transfer, and are available with RoHS compliant lead-free solder ball terminals.

Materials: Terminals are made from Brass - Copper Alloy (C36000), contacts from Beryllium Copper (C17200), and solder balls from either 63Sn/37Pb or lead-free 95.5Sn/4.0Ag/0.5Cu. Plating options include gold over nickel.

Performance: The connectors are durable for up to 500 mating cycles with minimal resistance change. Insertion and extraction forces are specified for a 6.00mm, 300 position connector. Mated height affects differential insertion and return loss at various frequencies.

Applications: These connectors are suitable for telecom switches, servers, laptops, processors, medical equipment, and military defense systems.

Packaging & Options: Male connectors come with a pick-up cap, and female connectors with a polyimide dot for automated processes. Packaging options include Tape and Reel or standard trays.

Ordering Information: Connectors are available in standard positions of 240, 300, and 400, with custom designs available upon request. Various mated heights and solder ball types are offered, with specific part numbers for different configurations.

Catalog excerpts

Specifications Features Terminals > ■ Brass - Copper Alloy (C36000) ASTM-B-16 Contacts: Beryllium Copper (C17200) ASTM-B-194 Solder Ball: > ■ Standard: 63Sn/37Pb Lead-free: 95.5Sn/4.0Ag/0.5Cu > Plating: G - Gold over Nickel Gold per ASTM-B-488 Nickel per QQ-N-290 Body Material: High Temp. Liquid Crystal Polymer (LCP) U.L. Rated 94V-0 > ■

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Board spacing Ֆ provides method to define stack height between two PC boards Compact design Ֆ conserves boardspace by combining many signal, ground, and power pins in a dense area Mission critical reliability Ֆ robustdesign for applications which require numerous mating/unmating cycles Blind mating Ֆ shrouded, guide boxdesign with integral polarization keying features RoHS Compliant Ֆ all materials arecompatible with high temperature reflow processes; select lead-free solder ball terminals for RoHS Compliant applications Custom designs available > 1.27mm Pitch Consult factory for custom sizes....

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