Specifications Features Terminals > ■ Brass - Copper Alloy (C36000) ASTM-B-16 Contacts: Beryllium Copper (C17200) ASTM-B-194 Solder Ball: > ■ Standard: 63Sn/37Pb Lead-free: 95.5Sn/4.0Ag/0.5Cu > Plating: G - Gold over Nickel Gold per ASTM-B-488 Nickel per QQ-N-290 Body Material: High Temp. Liquid Crystal Polymer (LCP) U.L. Rated 94V-0 > ■

Board spacing Ֆ provides method to define stack height between two PC boards Compact design Ֆ conserves boardspace by combining many signal, ground, and power pins in a dense area Mission critical reliability Ֆ robustdesign for applications which require numerous mating/unmating cycles Blind mating Ֆ shrouded, guide boxdesign with integral polarization keying features RoHS Compliant Ֆ all materials arecompatible with high temperature reflow processes; select lead-free solder ball terminals for RoHS Compliant applications Custom designs available > 1.27mm Pitch Consult factory for custom sizes....