Product Overview
Advanced Interconnections offers a diverse range of IC Sockets and Adapters suitable for various package configurations such as PGA, DIP, and SIP, including application-specific designs like Image Sensor Sockets. The company provides insulator options including FR-4, molded, and patented Peel-A-Way® Removable Terminal Carriers, which can be customized for different terminal types and footprints.

BGA Socketing Systems
The Ball Grid Array (BGA) Socket Adapter Systems and Flip-Top™ BGA Socket provide reliable solutions for socketing BGA, LGA, and CSP devices in validation, test, and production applications. These systems feature compact designs that match IC device footprints and patented solder ball terminals that offer process yields equivalent to direct device attach.

Board to Board Connectors
Advanced offers BGA Sockets, SMT Adapters, and B2B® SMT Connectors with lead-free solder ball terminals to comply with global directives. These connectors are designed for demanding board-to-board and mezzanine board applications, ensuring proven reliability and design flexibility.

Advanced® Adapters
Advanced® Adapters are customizable for IC package conversion, test, emulation, and development applications. Standard designs include SOIC to DIP and PLCC to PGA adapters, with options for custom designs that can incorporate device enhancements or corrections.

Custom Interconnect Solutions
Advanced provides comprehensive application and design assistance, offering unique designs that enhance functionality and reduce costs. The company boasts in-house capabilities for surface mount technology, PCB design, device attachment, automated optical inspection, and more.

Contact Information
Advanced Interconnections Corp., 5 Energy Way, West Warwick, RI 02893 USA. Tel: 800.424.9850 | 401.823.5200 | Fax: 401.823.8723 | Email: [email protected] | Website: www.advanced.com