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Standard Products Catalog
Standard Products Catalog
This document is a comprehensive catalog from Aavid Thermalloy, detailing heat sinks and related accessories. It includes contact information for sales offices in Europe, Asia, and America.
The catalog provides descriptions for heat sinks, base part numbers, and ordering information. It highlights popular options and accessories, with icons indicating compatible mounting kits, greases, or epoxies. Detailed descriptions and thermal graphs illustrate heat sink features and performance.
Guidance is provided on selecting heat sinks, reading thermal graphs, and understanding part numbers. Indexes are available by part number, device, thermal resistance, style, and options.
This section covers heat sinks for various IC packages, including BGA, DIP, and surface mount discrete semiconductor packages like D-PAK and SO, as well as thru-hole packages such as TO-220, TO-218, and TO-247.
The catalog lists options like interface materials (In-Sil™, Kondux™, Grafoil® Pads), mounts, clips, and accessories like mounting kits and insulating materials. It also details finishes and thermal greases and epoxies.
The 7022 channel style heat sink features folded back fins for increased cooling surface area and is available with tin-plated solderable tabs for easy attachment to printed circuit cards. Mechanical drawings, material specifications, and finish options are provided.
The document lists numerous heat sink models with dimensions, mounting styles, and thermal resistance values. It categorizes heat sinks into styles such as Slide On, Snap Down, Space Saving, and more.
Instructions are provided for calculating the required thermal resistance of a heat sink using the formula PD = ΔT / ΣRθ. This ensures the junction temperature of a semiconductor device remains below its maximum limit.
The document emphasizes selecting heat sinks based on semiconductor device requirements, including power dissipation and maximum junction temperature. It recommends using thermal interface materials like Hi-Flow® pads for optimal performance.
Graphs illustrate the thermal performance of heat sinks in natural and forced convection environments, helping predict temperature rise and determine thermal resistance under different airflow conditions.
Contact information for Aavid Thermalloy's offices in Europe, Asia, and America is provided, highlighting their design assistance services for custom heat sink solutions.
The document outlines the importance of proper mounting and using appropriate thermal interface materials to achieve desired thermal performance. It provides examples of selecting heat sinks for specific applications, considering factors like board space and height constraints.
The document outlines the Aavid Thermalloy part numbering system, explaining how to decipher part numbers and referring to an Option Index for further details.
Popular finishes include Black Anodize, Tin Plated, and others. A comprehensive list of available options for different part numbers is provided.
Various interface materials like In-Sil-8™ pads and KonDux™/Grafoil® Conducta-Pads are described, enhancing thermal performance and simplifying the manufacturing process.
Solderable nuts are integrated into heat sinks for efficient pre-assembly with transistors, ensuring mechanical and electrical integrity.
Clinch nuts facilitate quick transistor assembly to heat sinks with a single screw, reducing hardware needs.
Threaded solderable studs enhance production efficiency by reducing hardware requirements.
These clips eliminate the need for screws and nuts, reducing assembly time and cost.
Factory-installed thermal clips eliminate screws and nuts in heat sink and transistor assembly.
Mounting kits contain all necessary hardware to electrically isolate transistors from heat sinks.
Available in nylon or polyphenylene sulfide, these washers provide electrical insulation.
Thermalfilm™ MT is a low-cost insulating film offering high thermal conductivity and resistance to compressive stress.
Various mounting pads, finishes, card ejectors, thermal compounds, and epoxy systems are described, enhancing thermal management and ease of installation.
Each product has specific part numbers and packaging options for easy ordering.
Contact details for Aavid's offices in Europe, Asia, and America are provided for customer support and inquiries.
Catalog excerpts
USA Tel: +1 (603) 224-9988 email: [email protected] Italy Tel: +39 051 764011 email: [email protected] United Kingdom Tel: +44 1793 401400 email: [email protected] Singapore Tel: +65 6362 8388 email: [email protected] Taiwan Tel: +886(2) 2698-9888 email: [email protected]
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How to Use This Catalog Base part number Semiconductor device Icons indicate that a mounting kit, grease or epoxy can be used with the heat sink Style description for heat sink TO-220 Heat Sinks Grease & Epoxy page112 Channel style heat sink with folded back fins Semiconductor devices have been included in photos to assist in determining mounting position. Thermal graphs show natural and forced convection based on black anodize finish. For information on how to use a thermal graph, please refer to page 11. Detailed description illustrates the heat sink’s differentiating features. Channel style...
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AMERICA EUROPE www.aavidthermalloy.com USA Tel: +1 (603) 224-9988 email: [email protected] Italy Tel: +39 051 764011 email: [email protected] United Kingdom Tel: +44 1793 401400 email: [email protected] Singapore Tel: +65 6362 8388 email: [email protected] Taiwan Tel: +886(2) 2698-9888 email: [email protected] Index by Part Number
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Index by Device Cooled and Thermal Resistance Part Number Board Mounting Page BRIDGE RECTIFIERS Part Number Bi Directional Air Flow Solder Anchor Push Pin Clip Attachment Tape Attachment Board Mounting Page V = Vertical mount H–V = Either horizontal or vertical depending on device leads θn = Natural convection thermal resistance based on a 75°C heat sink temperature rise 501503B00000G 501603B00000G 505303B00000G PF527G 500103B00000G 576103B00000G 506003B00000G 500203B00000G 576203B00000G 579003B00000G 505403B00000G 576303B00000G 500303B00000G 569003B00000G 520103B00000G 576403B00000G 500403B00000G...
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Index by Device Cooled and Thermal Resistance Board Mounting Page Part Number Board Mounting Page Part Number Board Mounting Page AMERICA EUROPE www.aavidthermalloy.com USA Tel: +1 (603) 224-9988 email: [email protected] Italy Tel: +39 051 764011 email: [email protected] United Kingdom Tel: +44 1793 401400 email: [email protected] Part Number Board Mounting Page Part Number Singapore Tel: +65 6362 8388 email: [email protected] Taiwan Tel: +886(2) 2698-9888 email: [email protected]
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Index by Device Cooled, Heat Sink Style, and Thermal Resistance AXIAL LEAD Extruded Heat Sinks Slide On Heat Sinks Solder Anchor Clip Attachment Extruded Heat Sinks Channel Style Heat Sinks Clip On Style Heat Sinks Extruded Heat Sinks Plug In Style Heat Sinks Slide On Style Heat Sinks Mounting Page Diamond Shaped Basket Heat Sinks Horizontal mount Vertical mount Either horizontal or vertical depending on device leads Natural convection thermal resistance based on a 75°C heat sinktemperature rise Hat Section Heat Sink Space Saving Collar Heat Sinks Square Basket Heat Sinks Two Piece Heat Sinks...
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Index by Device Cooled, Heat Sink Style, and Thermal Resistance Part Number Board Mounting Page Part Number Board Mounting Page Part Number Hat Section Heat Sinks Low Cost Slide On Cooler Heat Sinks Board Mounting Page High Rise Style Heat Sinks 530101B00100G 6.3 506304B00000G 14.4 H–V Space Saving Staggered Heat Sink Plug In Style Heat Sink 592201B03400G 6.8 Slide On Heat Sink 7130DG 23.1 Low Profile Hat Section Heat Sink TO-220 Channel Style Heat Sink 593101B03600G 8.6 Dual Extruded Heat Sinks 533721B02552G 5.7 Dual High Rise Style Heat Sinks 530161B00162G 4.4 V Channel Style Heat Sinks AMERICA...
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Index by Device Cooled, Heat Sink Style, and Thermal Resistance Part Number Board Mounting Page AMERICA EUROPE www.aavidthermalloy.com Board Mounting Page Part Number Board Mounting Page Part Number 566902B04000G 18.8 Slide On Heat Sinks TO-247 Dual Extruded Heat Sinks 533721B02552G 5.7 V 533421B02552G 5.0 V 533521B02552G 4.5 V 533621B02552G 3.8 V Dual High Rise Style Heat Sinks 530161B00162G 4.4 V 530861B05162G 4.4 V Extruded Heat Sinks 513001B02500G 13.4 V 533001B02551G 13.0 V SW25-2G 11.4 V SW25-4G 11.4 V USA Tel: +1 (603) 224-9988 email: [email protected] Italy Tel: +39 051 764011 email: [email protected]...
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How To Select a Heat Sink How to select a heat sink The basic equation for heat transfer or power dissipation may be stated as follows: HOW TO SELECT A HEAT SINK Where: PD = the power dissipated by the semiconductor device in watts. ΔT = the temperature difference of driving potential which causes the flow of heat. ΣRθ = the sum of the thermal resistances of the heat flow path across which ΔT exists. The above relationship may be stated in the following forms: TC–TA TS–TA TJ–TA PD = PD = PD = RθCS + RθSA RθSA RθJC + RθCS + RθSA Where: TJ = the junction temperature in °C (maximum is usually stated...
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How To Select a Heat Sink Example B Find a space saving heat sink to keep a TO-220 device below the maximum 150°C junction temperature in natural convection. Device will be screw mounted with an electrically conductive interface. Find a heat sink to keep a TO-220 device below the maximum 150 °C junction temperature in forced convection at 400 ft/min. Device must be electrically insulated and mounted with a labor saving clip. Given: PD = 6 watts RθJC = 3°C/W (from semiconductor manufacturer) TJ max = 150°C (from semiconductor manufacturer) TA max = 65°C A KonduxTM pad is a good choice for electrically...
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CONVERTING VOLUME TO VELOCITY EXAMPLE: The output air volume of a fan is given as 80 CFM. The output area is 6 inches by 6 inches or 36 in2 or 25 ft2. To find velocity: 1000 20 Mounting Surface Temp Rise Above Ambient—°C Thermal Resistance From MTG Surface to Ambient—°C/Watt GRAPH A is used to show heat sink performance when used in a natural convection environment (i.e. without forced air). This graph starts in the lower left hand corner with the horizontal axis representing the heat dissipation (watts) and the vertical left hand axis representing the rise in heat sink mounting surface temperature...
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