Overview
3D-Micromac AG specializes in laser micromachining workstations for industrial and research applications, with a global presence in sectors like photovoltaics, semiconductors, and medical applications.
Laser Micromachining Technology
This technology includes micro drilling, cutting, structuring, and marking, offering high precision and minimal material damage. RAYLASE AG provides components for laser beam deflection and control, ensuring reliability.
Business Activities- Custom laser micromachining system development and production.
- Integration and retrofitting in production environments.
- Evaluation of new processes and technologies.
- Prototype production and limited lot manufacturing.
Medical Applications
Laser micromachining is used in manufacturing medical instruments and implants, providing precision and minimal heat-affected zones.
Photovoltaic Applications
Enhances solar cell efficiency through processes like laser drilling and structuring, ensuring high efficiency and minimal material damage.
Thin-Film Technologies
Specializes in laser machining of thin films for photovoltaics and OLED displays, allowing precise doping, structuring, and ablation.
Introduction to Laser Ablation in OLED Manufacturing
Laser ablation structures organic, semiconducting thin films in OLEDs without damaging substrates.
R2R Processing
Roll-to-roll laser machining systems process flexible substrates efficiently, reducing costs with continuous processing.
Importance of Micro Marking
Micro marking ensures product identification and traceability with precise, indelible markings.
Applications of Laser Micro Marking- Medical Technology: Germ-free micro engravings on implants and instruments.
- Semiconductor Industry: Hard or soft markings on materials.
- Photovoltaic Industry: Traceability markings on solar cells.
- Watchmaking and Jewellery Industry: Forgery-proof markings on metals.
Advanced Motion Control Solutions
Aerotech provides motion control solutions for laser processing, including direct-drive linear motors.
Laser Micro Drilling and Fine Cutting
Lasers drill fine holes and cut materials like foils and ceramics at a micro-scale, with technologies like helical drilling heads.
Applications in Semiconductor/MEMS Industry
Used for structuring semiconductor wafers and creating particle-free markings in silicon.
Conclusion
Laser technologies provide precise, efficient, and versatile solutions, enhancing product quality and manufacturing efficiency.