microSTRUCTvario

Product catalog summary

Overview
The document provides a detailed description of the microSTRUCTvario laser micromachining system developed by 3D-Micromac AG. This system is designed for ablation, structuring, cutting, and drilling of various materials, catering to the needs of industries such as electronics, semiconductor manufacturing, and medical technology.

System Description

Assembly: The system is built on a granite base, ensuring stability for all optical and mechanical components. It is housed to meet laser class 1 safety standards and has a protective degree of IP 20.
Laser Source/Optics: Capable of integrating two laser sources and three beam paths for different wavelengths. The standard laser source is a picosecond laser at 1064 nm, with options for other laser types.
Positioning System: Features a direct-driven system with an XY-traverse path of 1150 mm x 450 mm, offering high positioning accuracy and repeatability. The system is upgradeable with additional components like goniometers.
Workpiece Alignment: Offers manual, semi-automatic, or fully automatic alignment with an XY-system and optical measurement capabilities.
Working Area: Comprises three working areas, each 450 mm x 450 mm, suitable for various optical systems.
Suction: Prepared for integration with an exhaust system to manage ablated material.
Control Software: Multilingual software with remote access, customizable log files, and an intuitive graphical interface. Supports data import from GDS II, STL, and DXF formats.

Options and Applications

Options include fully automatic workpiece handling, integrated picture recognition, and quality control systems.
Applications span across the photovoltaic industry, medical technology, nozzle drilling, semiconductor/MEMS, automotive/aerospace, and security sectors.

Technological Capabilities

Includes microDrilling, microCutting, microAblation, microEngraving, and 2D/3D microStructuring.

Catalog excerpts

Laser Micromachining for Industrial Applications and R&D Laser micromachining system for ablation, structuring, cutting and drilling of various materials First Choice in microMachining First Choice in microMachining

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microSTRUCTvario Laser micromachining system for ablation, structuring, cutting and drilling microSTRUCTvario - System Description Assembly Due to the advancing miniaturization in electronics, semiconductor manufacturing and medical technology, it has become increasingly indispensable to possess the capability of machining smaller and finer structures into various substrates. The microSTRUCTvario system is equipped with three working areas and perfectly suited for the processing of different kinds of substrates, e.g. metals, alloys, transparent and biological material, ceramics and thin films....

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microSTRUCTvario

microSTRUCTvario

Catalog excerpts

All 3D Micromac catalogs and technical brochures