microSCRIBE

Product catalog summary

Overview: The document provides a detailed description of the microSCRIBETM laser micromachining system by 3D-Micromac AG, designed for high throughput laser processing of large panel sizes. It is applicable in various technologies including photovoltaic thin films, OLED processing, and more.

System Specifications:

Assembly: Features a granite base for mounting optical and mechanical components, housed for laser class 1 with a protective IP 20 rating, and weighs approximately 7 tons.
Laser Source/Optics: Capable of integrating up to two ultrashort pulsed lasers or five nanosecond lasers, with available wavelengths of 1064nm, 532nm, and 355nm. Additional laser types and optics can be integrated.
Positioning System: Utilizes an air bearing system with X, Y, and Z traverse paths of 1500mm, 1150mm, and 300mm respectively. Offers positioning accuracy of ±0.01mm and repeatability of ±0.05mm, with a maximum travel speed of 2 m/s.

Applications: Suitable for photovoltaic thin film technologies (CIS/CIGS, CdTe, aSi), organic photovoltaics, security applications, OLED processing, display machining, PCB structuring, glass panel cutting, and metal structuring.

Advantages: The system offers an open concept for integrating various lasers and a flexible control system for future upgrades. It supports semi-automatic or fully automatic workpiece alignment and optical measurement.

Working Area: Standard workpiece size is 1300mm x 1100mm, with options for larger sizes. The system includes a multilingual control software with remote access, customizable log files, and an intuitive graphical interface.

Options: Additional features include multiple laser beams, dynamic scribe tracking, inline concept with automatic loading/unloading, air extraction, and quality control systems.

Catalog excerpts

Laser Micromachining for Industrial Applications and R&D High throughput laser treatment of thin film panels First Choice in microMachining First Choice in microMachining

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High throughput laser treatment of thin film panels microSCRIBETM - System Description The laser micromachining system microSCRIBETM is suitable for the laser processing of large panel sizes, for example the thin film structuring of CIS or CIGS solar modules, but also for other technologies such as OLED processing, glass panel cutting and structuring, display machining, PCB structuring, etc. Typical processing methods for the existing thin film solar technologies are material removal at the panel edge to produce an electrical insulation to the panel frame and the surface structuring of thin layers...

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Laser Micromachining for Industrial Applications and R&D High throughput laser treatment of thin film panels First Choice in microMachining First Choice in microMachining

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microSCRIBE

microSCRIBE

Catalog excerpts

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