microFLEXTM
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Processing of Flexible Thin Films for Industrial Applications and R&D microFLEXTM Roll-to-roll processing system for the digital fabrication of printed functionalities First Choice in microMachining

Developments in the electronics and photovoltaics industry have been tending towards more reliable, resource-efficient, flexible and innovative applications and processes for the last few years. To take account of the needs of the market, 3D-Micromac focused on the development and the manufacturing of machines for the roll-to-roll processing of thin-films on flexible substrates, apart from classical tasks in laser micromachining. The composition of the materials can either be metal, dielectric semiconducting or organic. The thickness of the layers range from a few micrometers to nanometers....

microFLEXTM system - possible process integrations An individual standard fitting of the microFLEXTM system comprises the following processes: Screen printing The slot die coating system is made up of a coating head with a nozzle which is mounted perpendicular to the roll carrying the substrate. Coating material is injected into the nozzle chamber and its viscosity determines the kind of coating head used. With this printing technique the coating material is applied onto the substrate by spreading it on a framed, finely woven fabric (made of steel or synthetic fibre) through which it is...

Gravure printing Gravure printing is a direct printing technique. The system works with two rollers. The printing roller is engraved with patterns (cells) by means of etching, mechanical gravure or laser structuring. The second, so called impression roller is used to generate a defined nip with a homogenous pressure distribution. The coating material is applied on this printing cylinder by either a splash bath or an enclosed chamber system. the use of a laser source with optimal beam quality at very high output powers and pulse repetition rates of some megahertz. Such laser sources are able...

microFLEXTM system 3D-Micromac developed the microFLEXTM product family to process flexible thin-film substrates. The systems work with a rollto-roll process and are thus able to reduce the costs and effort for the production of devices. The modular design of microFLEXTM ensures high flexibility regarding different fields of component production for flexible electronics. Because of the modularity, 3D-Micromac is able to deliver a complete production line for the manufacturing of flexible electronics from the raw materials to encapsulated products. Green technology Less footprint needed for...

First Choice in microMachining