microDICETM

Product catalog summary

Introduction
The microDICETM system by 3D-Micromac is designed to enhance the separation of SiC wafers using TLS-DicingTM technology, which stands for Thermal-Laser-Separation. This system aims to improve cost efficiency, quality, and throughput in the semiconductor industry.

Key Features

Cost Efficiency: The system reduces dicing costs per wafer by eliminating tool wear and the need for expensive consumables.
High Performance: Offers superior edge quality and increased yield and throughput compared to traditional methods.
Process Speed: Provides higher process speed and throughput, suitable for high-volume production.

Technical Specifications

Wafer Size: Capable of handling wafers up to 300 mm (12 inches).
Laser Sources: Includes two integrated laser sources for cleaving and soft scribing, featuring long lifetime and low maintenance fiber lasers.
Positioning System: Features a direct drive XY-gantry system, rotation axis with vacuum chuck, and Z positioning system with high accuracy and repeatability.
Dicing Area: Accommodates up to 300 mm wafer size on tape and frame with an integrated micro stretching function.
Control Software: The microMMI software controls all hardware components and supports different user levels.

Optional Packages

Automated wafer handling
Independent scribing unit for higher throughput
SECS/GEM MES interface
Filter fan unit
Drying unit
Remote maintenance

Standards and Consumables

Compatible with common SEMI standards
Laser safety class 1
Clean room class 6
Requires cooling water, compressed air, electrical power, and a maximum of 600 ml DI-water for 1 hour of active dicing time

Machine Dimensions
2000 x 2000 x 1500 mm (W x H x D) including automatic handling.

Contact Information
3D-Micromac AG, Technologie-Campus 8, D-09126 Chemnitz, Germany. Tel: +49 (0)371 400 43-0, Email: [email protected], Web: www.3d-micromac.com

Catalog excerpts

Speed up your Back-End with TLS-DicingTM microDICETM Enabling TLS-DicingTM system for separation of SiC wafers First Choice in microMachining

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microDICETM Enabling TLS-DicingTM system for separation of SiC wafers Cost, quality, and throughput are major factors of success for SiC based devices in the semiconductor industry. 3D-Micromac answers this challenge with its brand-new microDICE™ system. TM The revolutionary, high-performance microDICE laser dicing system brings TLS-DicingTM technology (Thermal-Laser-Separation) to semiconductor‘s back-end. microDICETM is suitable to dice wafers up to 300 mm wafer size. The modular standard system configuration consists of: `` Cleaving funtion `` Soft scribe function `` Micro stretching function...

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Standard system configuration microDICETM Wafer size Laser sources ♦ Two integrated laser sources, one for cleaving and one for soft scribing process ♦ Long lifetime, low maintenance fiber lasers Positioning system ♦ Direct drive XY-gantry system ♦ Rotation axis with vacuum chuck ♦ Z positioning system for laser optics and camera ♦ Position accuracy over all axes: ± 0.005 mm ♦ Repeatability: ± 0.003 mm Dicing area ♦ Vacuum chuck accomodates up to 300 mm wafer size on tape and frame ♦ Integrated patented micro stretching function Control software ♦ Multilingual control software microMMI ♦ All...

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Picture I: Courtesy of Infineon AG Picture II: Courtesy of Fraunhofer IISB First Choice in microMachining

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microDICETM

microDICETM

Catalog excerpts

All 3D Micromac catalogs and technical brochures