Speed up your Back-End with TLS-DicingTM microDICETM Enabling TLS-DicingTM system for separation of SiC wafers First Choice in microMachining

microDICETM Enabling TLS-DicingTM system for separation of SiC wafers Cost, quality, and throughput are major factors of success for SiC based devices in the semiconductor industry. 3D-Micromac answers this challenge with its brand-new microDICE™ system. TM The revolutionary, high-performance microDICE laser dicing system brings TLS-DicingTM technology (Thermal-Laser-Separation) to semiconductor‘s back-end. microDICETM is suitable to dice wafers up to 300 mm wafer size. The modular standard system configuration consists of: `` Cleaving funtion `` Soft scribe function `` Micro stretching function...

Standard system configuration microDICETM Wafer size Laser sources ♦ Two integrated laser sources, one for cleaving and one for soft scribing process ♦ Long lifetime, low maintenance fiber lasers Positioning system ♦ Direct drive XY-gantry system ♦ Rotation axis with vacuum chuck ♦ Z positioning system for laser optics and camera ♦ Position accuracy over all axes: ± 0.005 mm ♦ Repeatability: ± 0.003 mm Dicing area ♦ Vacuum chuck accomodates up to 300 mm wafer size on tape and frame ♦ Integrated patented micro stretching function Control software ♦ Multilingual control software microMMI ♦ All...

Picture I: Courtesy of Infineon AG Picture II: Courtesy of Fraunhofer IISB First Choice in microMachining