2E MID Technology - 2 Pages

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2E MID Technology

Catalog excerpts

About us Comparison of manufacturing processes Surface Conductor thickness Conductor width Dimensions SMD assembly Wire bonding Hot embossing Sn, Au, Ag, Ni 18 µm – 70 µm min. 300 µm 2.5 D yes yes 2-shot Sn, Au, Ni 6 µm – 8 µm min. 250 µm 3 D yes yes LDS Sn, Au, Ni 6 µm – 8 µm min. 150 µm 3 D yes yes 2E manufactures components and systems for the interdisciplinary mechatronics industry in the following areas: • Automotive •  Industrial Electronics •  Medical Technology • Automation •  Sensor technology Prototyping 3. Production of milled part 2. CAD 1. Idea 6. Assembled and inspected specimen 5. Electroless plating Our MID demonstrator shows the possibilities of MID technology with regard to miniaturisation and reduction of part variety. Mechanical as well as electrical functions can be integrated in one single component. 4. Lasering Effective production process of samples for LDS-MID at 2E Advantages •  Original material/series-ready •  Within two weeks •  Complete functionality 2E mechatronic GmbH & Co. KG narr group Maria-Merian-Straße 29 73230 Kirchheim unter Teck Telefon: +49 7021 9301-0 Telefax: -70 info@2e-mechatronic.de www.2e-mechatronic.de MID-Technology Molded Interconnect Devices The term MID – Molded Interconnect Devices – describes the manufacturing process and the function of the component.

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Quelle: PKT GmbH Quelle: BUSS GmbH & Co KG Hot embossing process Two Shot Injection Moulding The conductor paths are embossed on the plastics with a certain pressure and temperature using a hot stamping die. In two steps, a metallizable and a non-metallizable plastics are injected to an MID base body. Then the conductor paths are metallized in an electroless plating. Laser Direct Structuring (LDS) First of all the layout of the conductor path is written on the injection moulded component by laser. At the same time a compounded additive is activated in the plastics. Subsequently, the...

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