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High-End SPI System for In-Line Manufacturing Broad networking options via Viscom‘s Quality Uplink iS6059 SPI Excellent technology for solder and sinter paste inspection
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FAST, VERSATILE, RELIABLE High-Throughput Paste Inspection with Maximum Accuracy Extremely high throughput due to FastFlow handling Enhanced quality and speed of inspection Four angled views for shadow-free inspection images Color-assisted 3D solder paste volume calculation High reproducibility Very easy operation: color images for verification and efficient program generation Customer hotline and website, remote maintenance The iS6059 SPI is a 3D SPI system that offers unbeatable advantages for economical SMT production. Key features include an Paste bridge after soldering inspection speed...
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FAST, VERSATILE, RELIABLE Side view Top view Inspection scope Camera technology XM-SPI-II
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Shanghai Huizhou Headquarters: Viscom AG Carl-Buderus-Str. 9-15 30455 Hanover Germany Phone: +49 511 94996-0 Email: info@viscom.de Europe Viscom France S.A.R.L. 6, rue Saint Simon Zone du Vert Galant 95310 Saint-Ouen l'Aumone France Phone: +33 134 641616 Email: info@viscom.fr Africa Viscom Tunisie S.A.R.L. Rahma Building; App B5, Block B, 2nd floor Lac Houran Street - Berges du Lac 1053 Tunis, Tunisia Phone: +216 71960584 Email: info@viscom.fr Americas Viscom Inc. 1775 Breckinridge Parkway Suite 500, Duluth (Atlanta) GA 30096, USA Phone: +1 678 966-9835 Email: info@viscomusa.com Viscom Inc....
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