PV Series
1 / 6ページ

カタログの抜粋

A worldwide leader in precision measurement solutions High Speed Multi-Channel, TTV and Bow Measurement Module for In-process Monitoring of Solar/Photovoltaic Wafers MULTIPLE MODULAR TYPE AMPLIFIERS CAN BE CHAINED TOGETHER FOR UNLIMITED LINE SCANS ON THE WAFERR

カタログの1ページ目を開く

Advanced Features Up to three thickness channels per rack Minimum, maximum, average and total thickness variation measurements Bow measurement (3 probe pairs required) Integrated data aquisition and control electronics Fast Ethernet communications ports for production rates up to 5 wafers per second Scalable for increased number of thickness line scans Digital I/O for interface with existing wafer handling equipment Windows® based control program for local or remote data monitoring Windows® based DLL package for integration with existing control PC's Standard and custom probe sizes...

カタログの2ページ目を開く

PV-1000 Wafer Metrology Systems The PV-1000 solar wafer measurement series are ideal for both process development and production environments. Using MTII’s exclusive Push/PullTM capacitance probe technology, each PV-1000 module provides up to three pairs of probes for measurement of maximum, minimum and average thickness, as well as total thickness variation (TTV) and wafer bow. For applications requiring additional thickness channels, multiple PV-1000 modules can be chained together for unlimited line scans on the wafer. Integrated data acquisition and control electronics analyze and...

カタログの3ページ目を開く

11.58 mm (0.456 inch) 20 mm (0.787 inch) 100 mm (3.937 inch) 11.58 mm (0.456 inch) 16 mm (0.63 inch) 100 mm (3.937 inch) Spot Size Spot Size Range Extension Range Extension 9.45 mm (0.372 inch) 14.8 mm (0.583 inch) 34.04 mm (1.34 inch) Spot Size 7.11 mm (0.28 inch) 16 mm (0.63 inch) 50 mm (1.969 inch) Range Extension Range Extension Probe Connector Types: ILA Integrated Lead Axial ILR Integrated Lead Radial

カタログの4ページ目を開く

Specifications Wafer Types Mono or Poly-Crystalline Silicon Surface Types As-Cut, Lapped, Etched, SiN Layer Data Output Data Triggering Rack Dimensions Power Requirements AC (DC Version also available, call MTII for information) Thickness Measurement Probe Range Measurement Accuracy Repeatability Distance between sensors 1778 µm / 70 mils ±0.25 µm / ±0.010 mils 0.05 µm / 0.002 mils 3.4 mm / 0.134 in 2540 µm / 100 mils ±0.75 µm / ±0.030 mils 0.10 µm / 0.004 mils 5.0 mm / 0.197 in Custom probe sizes and measurement ranges available Optional Accessories Product # Product Description 90 Ω Low...

カタログの5ページ目を開く

Tips for Quick Ordering Process Modular Rack Systems For measuring thickness of solar wafers or semiconductor wafers in automated track systems. Select Model All models below includes amplifier card rack with interface electronics. Proforma PV-1000 Models 2 amplifier cards, software and communication interface for one (1) thickness channel 4 amplifier cards, software and communication interface for one (2) thickness channels 6 amplifier cards, software and communication interface for one (3) thickness channels Select Push/Pull Probes Push/Pull Probes Custom Probes are also available Refer...

カタログの6ページ目を開く