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Axion® T2000

Axion® T2000
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Product Fact Sheet High resolution CD-SAXS metrology system provides fast, accurate, non-destructive, 3D shape measurements for complex, high aspect ratio 3D NAND and DRAM device structures The Axion® T2000 leverages innovative X-ray technology to identify subtle structural variations that can affect memory device functionality or performance. By providing high resolution, non-destructive 3D device shape measurements, the Axion T2000 helps advanced memory manufacturers:  Achieve fast cycles of learning during R&D, thereby reducing dependence on long lead time, destructive measurement methods such as FIB-SEM, TEM and cross-section SEM  Accelerate ramp cycle time through fast and accurate characterization and optimization of new processes, design nodes and devices  Monitor key process steps inline to ensure variations that affect device quality are identified and addressed quickly during high volume production  Non-destructive CD-SAXS measurement technique  High flux X-ray source  Largest diffraction order separation  High resolution detector  Precision motion control with market-leading dynamic range AOI (angle of incidence) stage  AcuShape® modeling  Process characterization and optimization  Engineering analysis  Inline process monitoring  Etch process tool monitoring  Post-PM (preventative maintenance) etch process tool qualification MARKET: Chip manufacturing advanced design node memory devices, including 3D NAND and DRAM  Customizable configurations  Extendible  300mm wafers MORE INFORMATION:

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Axion® T2000
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