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MPPC® (Multi-Pixel Photon Counter) S13360 series MPPCs for precision measurement MPPC is a type of device called SiPM (silicon photomultipliers). It is a new type of photon counting device that consists of multiple Geiger mode APD (avalanche photodiode) pixels. It is an opto-semiconductor with outstanding photon counting capability and low operating voltage and is immune to the effects of magnetic fields. The S13360 series are MPPCs for precision measurement. The MPPCs inherits the superb low afterpulse characteristics of previous products and further provide lower crosstalk and lower dark count. They are suitable for precision measurement, such as flow cytometry, DNA sequencer, laser microscope, and fluorescence measurement, that requires low noise characteristics. Reduced crosstalk and dark count (compared to previous products) Fluorescence measurement Outstanding photon counting capability (outstanding photon detection efficiency versus numbers of incident photons) Flow cytometry Laser microscopes DNA sequencers Environmental analysis Operates at room temperature Low voltage (VBR=53 V typ.) operation Various academic research High gain: 105 to 106 Excellent time resolution Immune to the effects of magnetic fields Operates with simple readout circuit MPPC module also available (sold separately) Lower noise When an MPPC detects photons, the output may contain spurious pulses, namely afterpulse and crosstalk, that are separate from the output pulses of the incident photons. Afterpulses are output later than the timing at which the incident light is received. Crosstalk is output from other pixels at the same time as the detection of light. Previous products achieved lower afterpulse through the improvement of material and wafer process technology, but with the S13360 series, low crosstalk has been achieved in addition to low afterpulse. Pulse waveform comparison (typical example) Previous product Improved product (reference data: S13360-3050CS series) (M=1.25 × 106)
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MPPC (Multi-Pixel Photon Counter) Selection guide Type no. Effective photosensitive area (mm) 1.3 × 1.3 Fill factor (%) Package Ceramic Surface mount type Ceramic Surface mount type Ceramic Surface mount type Ceramic Surface mount type Ceramic Surface mount type Ceramic Surface mount type Ceramic Surface mount type Ceramic Surface mount type Ceramic Surface mount type Structure / Absolute maximum ratings Type no. (package) S13360-****CS (ceramic) S13360-****PE (surface mount type) Window material Refractive index of window material Silicone resin Absolute maximum ratings Operating Storage...
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MPPC (Multi-Pixel Photon Counter) Electrical and optical characteristics (Typ. Ta=25 °C, unless otherwise noted) Dark count*5 Photon Spectral Peak detection Measure- response sensitivity efficiency range wavelength ment PDE*4 λp λ conditions λ=λp Temperature Recomcoefficient mended Crosstalk at recomoperating probability mended voltage operating Vop voltage ΔTVop (%) (V) (mV/°C) *4: Photon detection efficiency does not include crosstalk or afterpulses. *5: Threshold=0.5 p.e. Note: The above characteristics were measured at the operating voltage that yields the listed gain. (See the data...
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MPPC (Multi-Pixel Photon Counter) Photon detection efficiency vs. wavelength (typical example) Pixel pitch: 25 μm Photon detection efficiency (%) Photon detection efficiency (%) Photon detection efficiency (%) Photon detection efficiency does not include crosstalk or afterpulse
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MPPC (Multi-Pixel Photon Counter) Overvoltage specifications of gain, crosstalk probability, photon detection efficiency (typical example) Gain Crosstalk probability Photon detection efficiency (λ=450 nm) 30 Crosstalk probability, photon detection efficiency (%) 6 × 106 Gain Crosstalk probability Photon detection efficiency (λ=450 nm) Crosstalk probability, photon detection efficiency (%)
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MPPC (Multi-Pixel Photon Counter) 1.6 × 107 Gain Crosstalk probability Photon detection efficiency (λ=450 nm) Crosstalk probability, photon detection efficiency (%) MPPC characteristics vary with the operating voltage. Although increasing the operating voltage improves the photon detection efficiency and time resolution, it also increases the dark count and crosstalk at the same time, so an optimum operating voltage must be selected to match the applicati
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MPPC (Multi-Pixel Photon Counter) Dimensional outlines (unit: mm) S13360-1325CS/-1350CS/-1375CS +0 Cathode terminal indicator hole Silicone resin Photosensitive surface ϕ0.45 ± 0.05 Lead 3.0 ± 0.2 Lead material: Fe-Ni-Co alloy Lead processing: Au plating Tolerance unless otherwise noted: ±0.2 Chip position accuracy: X, Y≤±0.25 with respect to package center The coating resin may extend a maximum of 0.1 mm above the upper surface of the package. KAPDA0155EA Silicone resin Photosensitive surface Lead material: Oxygen-free copper Lead processing: Au plating Tolerance unless otherwise noted:...
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MPPC (Multi-Pixel Photon Counter) Photosensitive surface Silicone resin Index mark: Cathode Lead material: Fe-Ni-Co alloy Lead processing: Au plating Tolerance unless otherwise noted: ±0.2 Chip position accuracy: X, Y≤±0.3 with respect to package center The coating resin may extend a maximum of 0.1 mm above the upper surface of the package. KAPDA01
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MPPC (Multi-Pixel Photon Counter) Epoxy resin Photosensitive surface NC Cathode Anode NC Index mark Tolerance unless otherwise noted: ±0.1 * Distance from chip center to package center Epoxy resin Photosensitive surface Index mark Tolerance unless otherwise noted: ±0.1 * Distance from chip center to package center KAPD
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MPPC (Multi-Pixel Photon Counter) Epoxy resin Photosensitive surface Tolerance unless otherwise noted: ±0.1 * Distance from chip center to package center Index mark
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MPPC (Multi-Pixel Photon Counter) Recommended land pattern (Unit: mm) S13360-1325PE-1350PE/-1375PE Temperature profile measurement example using our experimental hot-air reflow oven (S13360-1350PE) 300 °C 240 °C max. ∙ This surface mount type package product supports lead-free soldering. After unpacking, store it in an environment at a temperature of 25 °C or less and a humidity of 60% or less, and perform soldering within 24 hours. ∙ The effect that the product is subject to during reflow soldering varies depending on the circuit board and reflow furnace that are used. Before actual reflow...
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