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BOARD TO BOARD CONNECTORS MEG-Array® MEZZANINE Connector system HIGH DENSITY, BGA DESIGN EXCELS AT HIGH SPEED PERFORMANCE AND RELIABILITY DESCRIPTION The MEG-Array® Mezzanine Connector system provides the high density and high speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly. 1.27mm x 1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high speed signal integrity at speeds exceeding 10 Gb/s. MEG-Array is offered in a variety of PCB mezzanine stack heights. FCI’s advanced manufacturing supports a patented BGA interconnect design. Multiple in-process vision systems monitor BGA contact integrity including solder sphere size, location and co-planarity plus other critical-to-function attributes. FEATURES & BENEFITS TARGET MARKETS / APPLICATIONS High density, high speed, discrete contact, array connector Flexible ground distribution optimizes high speed signal integrity 10 Gb/s differential pair performance with under 1% cross-talk 28 Gb/s high speed performance documented for 4mm and 6mm stack height Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market 1.27mm x 1.27mm grid provides 71 contacts per cm2 density to save space COMMUNICATIONS Transmission Access Switching Optics Networking Wide range of sizes and PCB stack heights increase mechanical design flexibility 6 PCB Stack heights: 4mm to 14mm 8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform High density standard BGA attachment lowers assembly costs by using standard SMT processes BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage Patented BGA contact attachment preserves solder ball positioning Optimized PCB routing enhances electrical performance Quality and Reliability Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options 22+ year solder joint reliability per IPC-SM-785 17 Billion + lines shipped to customer satisfaction Precious metal plating options satisfy varying customer needs for environmental resistance DATA Servers Storage I&I Industrial controls & equipment Analytical & diagnostic Medical

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MEG-ARRAY® CONNECTOR SYSTEM Housing: Liquid Crystal Polymer Contact: Copper Alloy Plating: Au over Ni OR GXT™ over Ni Meets requirements of Telcordia GR-1217-CORE issue I Meets requirements of NPS-25298-2 (25 year life expectancy) (supporting test reports can be obtained at: MECHANICAL PERFORMANCE Contact Wipe: 0.80mm Nominal IPC-SM-785 Solder Joint Reliability: 22.1 year product end-of-life ELECTRICAL PERFORMANCE Current Rating: • 2.0 A < 30°C AT (Single Contact Energized) Low Level Contact Resistance: See product specification GS-12-100 for performance results of specific stack Dielectric...

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MEG-ARRAY® MATED HEIGHTS - BASE PART NUMBER SELECTOR

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MEG-ARRAY® INTERCONNECT PART NUMBERS - PLUGS Contact Area Finish Part Numbers RoHS Compliant Pb-Free BGA

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MEG-ARRAY® CONNECTOR SYSTEM MEG-ARRAY® INTERCONNECT PART NUMBERS - Au *AII connectors are supplied with a pre-installed pickup cap. MEG-ARRAY® INTERCONNECT PART NUMBERS - GXT ON BACK

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MEG-ARRAY® CONNECTOR SYSTEM MEG-ARRAY® INTERCONNECT PART NUMBERS - GXT *AII connectors are supplied with a pre-installed pickup cap. Use web link www.fciconnect.com/megarray to obtain product drawings and additional technical information

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