TS Solutions - 112 Pages

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Catalogue excerpts

FULL PRODUCT LINE TEST SOLUTIONS

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AVAILABLE CATALOGUES CIRCULAR METRIC CONNECTORS Y-CIRC® M INDUSTRIAL RJ45 CONNECTORS Y-CON Configure your product online! configurator.yamaichi.de CIRCULAR PUSH-PULL CONNECTORS Y-CIRC P CIRCULAR PUSH-PULL CONNECTORS Y-CIRC® P CIRCULAR METRIC CONNECTORS Y-CIRC® M INDUSTRIAL CONNECTORS Y-CON® INPUT OUTUT CONNECTORS INTERNAL CONNECTORS CARD CONNECTORS INPUT / OUTPUT CONNECTORS INTERNAL CONNECTORS CARD CONNECTORS AUTOMOTIVE SOLUTIONS HIGH SPEED DATA NETWORKING SOLUTIONS FULL PRODUCT LINE TESTSOLUTIONS AUTOMOTIVE SOLUTIONS HIGH SPEED DATA NETWORKING SOLUTIONS FULL PRODUCT LINE TS SOLUTION

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ABOUT YAMAICHI ELECTRONICS / ÜBER YAMAICHI ELECTRONICS YAMAICHI ELECTRONICS FACTS & FIGURES YAMAICHI ELECTRONICS ZAHLEN & FAKTEN Firmengründung: Konzernsitz, Tokyo: 1956 Headquarters, Tokyo: 1956 European Headquarter, Aschheim near Munich: 1986 Europäische Zentrale, Aschheim bei München:1986 über 2100 weltweit, 240 in Europa* Certification: DIN EN ISO 9001:2008 Production in Frankfurt/Oder, since 2006: Produktion in Frankfurt/Oder, seit 2006: Worldwide 7 production sites, 6 design centers, 13 sales locations weltweit 7 Produktionsstandorte, 6 Design-Zentren, 13 Vertriebszentren PRODUCT RANGE Yamaichi...

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TABLE OF CONTENTS Pin Through Hole Devices SIP (Single Inline Package) to 2.0mm pitch, with dual wipe contacts 1.27 ZIP (Zig-Zag Inline Package) to 1.778mm pitch, with dual wipe contacts 1.27 CONTACTING - SEMICONDUCTOR DIP / SDIP (Dual Inline Package) 2.54mm pitch, for P-DIP and side braze packages Shrink 1.778mm pitch, for HD mounting (SDIP) Shrink 1.778mm pitch, plus piggy-back option (SDIP) PGA / ZIF (Pin Grid Array / Zero Insertion Force) 2.54mm pitch, wiping action system 1.27 / 2.54mm pitch, wiping action sytem SMT Devices SOJ (Small Outline J-Leads) 1.27mm pitch, dead-bug and live-bug insertion PLCC...

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SPECIALITIES    PCB SOLUTIONS    CONTACTING - MODULES    CONTACTING - SEMICONDUCTOR TABLE OF CONTENTS CONTACTING - SEMICONDUCTOR

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CONTACTING - SEMICONDUCTOR PIN THROUGH HOLE DEVICES SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING - SEMICONDUCTOR

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SERIES IC70 SINGLE INLINE PACKAGE (SIP) - TH SPECIFICATIONS Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: MATERIALS AND FINISH Housing:    PSF,Polysulphon glass-filled PES Polyester glass-filled Contacts:    Beryllium Copper (BeCu) Plating:    Gold over Nickel FEATURES • 1.27 to 2.00mm pitch • Dual wipe contacts ensure high reliability • Low costs due to selective gold plating OUTLINE SOCKET DIMENSIONS 1.27 TO 2.00MM PITCH PART NUMBER IC70 - 30    11 MF - G 4 MF = Flanged Unmarked = Not Flanged OUTLINE SOCKET...

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SPECIFICATIONS Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: MATERIALS AND FINISH Housing: Contacts: Plating: Polyethersulphone (PES), glass-filled Beryllium Copper (BeCu) Gold over Nickel MF = Flanged Unmarked = Not Flanged PTH DEVICES - SIP / ZIP FEATURES • 1.27 to 1.778mm pitch • Applicable for Zig-Zag mounted leads • Dual wipe contacts ensure high reliability OUTLINE SOCKET DIMENSIONS RECOMMENDED PCB LAYOUT Top View from Socket 1.27 TO 1.778MM PITCH Part Number    Pin Count    Pitch    ABC    D    F    G    H SPECIFICATIONS...

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YAMAICHI ELECTRONICS SERIES IC37 DUAL INLINE PACKAGE (DIP) - TH SPECIFICATIONS Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: MATERIALS AND FINISH Housing:    Polyphenylenesulfide (PPS), glass    filled Contacts:    Beryllium Copper (BeCu) Plating:    Gold over Nickel FEATURES • 2.54mm pitch • Dual wipe contacts ensure high reliability • Low costs due to selective gold plating • Applicable for IC packages and side braze packages • Ideal for automated burn-in PART NUMBER IC37N R B Series No. Contact Plating:...

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,YAMAICHI    ,    , SERIES IC76 SHRINK DUAL INLINE PACKAGE (SDIP) - TH SPECIFICATIONS Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: MATERIALS AND FINISH Housing:    Polyethersulphone (PES), glass-filled Contacts:    Beryllium Copper (BeCu) Plating:    Gold over Nickel FEATURES • Shrink pitch (1.778mm) sockets for high-density mounting • Dual wipe contacts ensure high reliability PART NUMBER Series No. Housing Material: 20 = PES No. of Contacts Row Space (0.6 = 0.6 inches) Contact Plating (G = Gold Plating) Straight...

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SERIES IC121 SHRINK DUAL INLINE PACKAGE (SDIP) - TH SPECIFICATIONS Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Current Rating: Operating Temperature Range: Mating Cycles: MATERIALS AND FINISH Housing:    Polyetherimide (PEI), glass-filled Contacts:    Copper Alloy Plating:    Gold over Nickel FEATURES • Shrink pitch (1.778mm) sockets for high-density mounting • Dual wipe contacts ensure high reliability • Two terminal lengths (3mm / 5mm) available. The 5mm type can be used as a piggy-back socket PART NUMBER Terminal Length Option: L = 5mm Unmarked = Not Flanged MF...

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@YAMAICHI    ,    , SPECIFICATIONS Insulation Resistance: Dielectric Withstanding Voltage: Contact Resistance: Operating Temperature Range: MATERIALS AND FINISH Housing:    Polyetherimide (PEI), glass-filled Contacts:    Beryllium Copper (BeCu) Plating:    Gold over Nickel FEATURES • Wiping action system: Cleans up IC lead surface during handling action • Reliable 3 point contact system • Cost performance: Different contact thickness for contact area and terminal area • Depopulated versions available • Also available with lever on the right hand side, standard type is lever on the left hand side •...

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