Burn-in Sockets - Yamaichi Electronics - (Version JPG) - Page n° 9 - PDF Catalogue | Technical Documentation

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Twisted pair cable, Junction box, Pin grid array, AdvancedMC, D-sub connector

Text version of the page

0.80mm a 0.80x1.00mm Pitch

Product Line-up (0.80mm)

TÇJmÏ; ▼ ¡rf SU/Features

Also available for low-height solder ball.

U-shape contact minimizes contact mark on solder ball.

Wiping effect enhances contact to Pb-free packages.

NP470-01 rnaxt

: 14X22

SOCKET BASE

LINE-UP

Product Line-up (0.80x1.00mm)

PKG Size (mm)

Grid

3,4

4,5,6

6,7

7,8

8,9

9,10,11

11,12

12,13

13,14

14,15,16

Open Top Type

BGA

▼ *rf St/Features_

■ if\-)WX-V£ffi&t3>y'(V-z\y$t>Y>

■ Tweezer style contact minimizes contact mark on solder ball.

■ Dual-contact points ensure high contact reliability.

■ Prevents contact from ball-sticking.

■ Handles various thickness of packages.

NP367 series

NP367-10810& 10819 max grid : 9X12 NP367-12603& 12615 max grid : 9X14

SOCKET BASE

LINE-UP

YAMAICHI ELECTRONICS