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AA series - 10 Pages

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Catalogue excerpts

DATA SHEET ANTI-SULFURATED CHIP RESISTORS AUTOMOTIVE GRADE AA series ±5%, ±1%, ±0.5% sizes 0201/0402/0603/0805/1206/ 1210/1218/2010/2512 Product specification –December 08, 2015 V.3 RoHS compliant & Halogen fr

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Product specification Chip Resistor Surface Mount SCOPE This specification describes AA0201 to AA2512 chip resistors with leadfree terminations made by thick film process. ORDERING INFORMATION - GLOBAL PART NUMBER Part number is identified by the series name, size, tolerance, packaging type, temperature coefficient, taping reel and resistance value. GLOBAL PART NUMBER AA XXXX X X X XX XXXX L Engine control unit Body control system Safety devices FEATURES  Superior resistance against sulfur containing atmosphere  Moisture sensitivity level: MSL1 AA series soldering is compliant with J-STD-020D Halogen...

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Product specification Chip Resistor Surface Mount E-24 series: 3 digits, ± 5% First two digits for significant figure and 3rd digit for number of zeros Fig. 2 E-24 series: 3 digits, ± 1% One short bar under marking letter Fig. 3 E-96 series: 3 digits, ± 1% First two digits for E-96 marking rule and 3rd letter for number of zeros Fig. 4 Both E-24 and E-96 series: 4 digits, ± 1% First three digits for significant figure and 4th digit for number of zeros Fig. 5 Value = 10 KΩ E-24 series: 3 digits, ± 5% First two digits for significant figure and 3rd digit for number of zeros Fig. 6 Value = 10 KΩ Both...

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Product specification Chip Resistor Surface Mount CONSTRUCTION The resistors are constructed on top of an automotive grade ceramic body. Internal metal electrodes are added at each end and connected by a resistive glaze. The resistive glaze is covered by a lead-free glass. The composition of the glaze is adjusted to give the approximately required resistance value and laser trimming of this resistive glaze achieves the value within tolerance. The whole element is covered by a protective overcoat. Size 0603 and bigger is marked with the resistance value on top. Finally, the two external terminations...

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Product specification Chip Resistor Surface Mount ELECTRICAL CHARACTERISTICS Table 2 CHARACTERISTICS Operating Max. Max. Dielectric RESISTANCE RANGE Temperature Range Working Overload Withstanding Voltage Voltage Voltage Temperature Coefficient of Resistance 1Ω ≤ R ≤ 10Ω , Rated Current Rated Current Jumper Criteria Rated Current ± 200 ppm/°C Rated Current ± 150 ppm/°C Rated Current 10 MΩ < R ≤ 22 M Ω , ± 200 ppm/°C Rated Current Max. Current 10A Rated Current Max. Current 10A Rated Current

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Product specification Chip Resistor Surface Mount FOOTPRINT AND SOLDERING PROFILES Recommended footprint and soldering profiles. Please refer to data sheet “Chip resistors mounting”. PACKING STYLE AND PACKAGING QUANTITY Table 3 Packing style and packaging quantity PACKING STYLE Paper/PE taping reel (R) Embossed taping 7" (178 mm) reel (K) RESISTANCE TEMPERATURE COEFFICIENT OF RESISTANCE RANGE NOTE 1. For paper/PE/embossed tape and 100 mΩ to 910 mΩ reel specifications/dimensions, please refer to data sheet “Chip resistors packing”. PT040 2 ± 200 ppm/°C PT060 ± 200 ppm/°C 3 FUNCTIONAL DESCRIPTION...

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Product specification Chip Resistor Surface Mount TESTS AND REQUIREMENTS Table 4 Test condition, procedure and requirements TEST TEST METHOD PROCEDURE High Temperature Exposure Moisture Resistance Each temperature / humidity cycle is defined at 8 hours (method 106F), 3 cycles / 24 hours for 10d. with 25 °C / 65 °C 95% R.H, without steps 7a & 7b, unpowered Parts mounted on test-boards, without condensation on parts Biased Humidity 1,000 hours; 85 °C / 85% RH 10% of operating power Measurement at 24± 4 hours after test conclusion. Operational Life Condition B, no pre-heat of samples Lead-free solder,...

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Product specification Chip Resistor Surface Mount TEST METHOD Solderability - Wetting Electrical Test not required Magnification 50X Well tinned (≥95% covered) (a) Method B, aging 4 hours at 155 °C dry heat, dipping at 235± 3 °C for 5± 0.5 seconds. (b) Method B, steam aging 8 hours, dipping at 215± 3 °C for 5± 0.5 seconds. (c) Method D, steam aging 8 hours, dipping at 260± 3 °C for 7± 0.5 seconds. Board Flex Chips mounted on a 90mm glass epoxy resin PCB (FR4) Bending for 0201/0402: 5 mm 0603/0805: 3 mm 1206 and above: 2 mm Holding time: minimum 60 seconds Temperature Coefficient of Resistance...

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YAGEO, Phfcomp Chip Resistor Surface Mount I AA | SERIES | 0201 to 2512 REVISION HISTORY REVISION DATE CHANGE NOTIFICATION DESCRIPTION Update Dielectric Withstanding Voltage Modified FOS test procedure Dimensions update First issue of this specification

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Product specification Chip Resistor Surface Mount LEGAL DISCLAIMER Yageo, its distributors and agents (collectively, “Yageo”), hereby disclaim s any and all liabilities for any errors, inaccuracies or incompleteness contained in any product related information, including but not limited to product specifications, datasheets, pictures and/or graphics. Yageo may make changes, modifications and/or improvements to product related information at any time and without notice. Yageo makes no representation, warranty, and/or guarantee about the fitness of its products for any particular purpose or the...

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