| | | Optical ■ Afocal stereo zoom Expanded-Pupil microscope provides a 26.4° field angle. ■ Expanded-Pupil patented technology optimises head and body freedom providing 10 times greater head freedom than conventional binocular eyepiece microscopes. Zoom Magnification (see table below) ■ x7 - x40 multiplied by combinations of objective lenses and multipliers (total zoom magnification range x2.1 - x160). ■ Zoom ratio 5.7:1 ■ Secondary multipliers x1.5 and x2.0 ■ Reducing objectives to increase working distance and field of view. ■ Magnifying objectives to increase total magnification. Illumination ■ 12V/60W semi-coaxial long-life spotlamps. ■ 6 or 10-point ringlight options with 21V/150W Halogen lamp. ■ Substage illumination (bench stand only) 12V/20W Halogen lamp. ■ Option of tilting substage illuminator to enhance contrast. | | Oblique and Direct Viewer ■ Allows the operator to view a subject from an angle of 34° from vertical, which can be rotated through to 360° enabling a better stereo view of 3-dimensional subjects including PCB solder joints, holes, pillars and thread forms. Both manual and motorised versions are available. | | |
| | | Fixed Angle Viewer ■ Allows the user three options; a fixed angle of 25° from vertical, the ability to view vertically or tilting the optica head and using the system standing up. Fixed angle viewer Ergowedge ■ Allows the view to be adjusted between -5° and -25° from horizontal. Image Capture and Archive ■ Digital, USB and 35mm SLR industrial cameras including Sony, Nikon, Pixera, Canon and other leading makes. ■ Modular multimedia solutions for image archiving, acquisition, processing, analysis and documentation. | | |
| | | ■ Superb stereo vision gives unsurpassed crack and coating visibility. ■ Fast & accurate fault detection. ■ Enhanced productivity and reduced scrap rates. Fault detection is made more effective by magnification, highlighting minute cracks and pitting. Alternate UV / white light inspection can be selected with a footswitch allowing the inspector hands-free component manipulation. | | |