HB16D Wire & Die Bonder - TPT Wire Bonder, Franz & Fabian Hickmann GbR - (Version JPG) - PDF Catalogue | Technical Documentation

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		HB16D Wire & Die Bonder
ipr		HB16D Wire & Die Bonder
ipr

			Wire Bonding + Wedge and Ball Bonding + 17\|j to 50p Wire and 25p x 200p Ribbon + Loop Profile Programmable + Stitch bonding and Bump bonding + Electronic ball size control + Motorised Wire Clamp + Motorized 2" Wire Spool Holder Die Bonding + Placement accuracy +/- 25p + Substrat Size max. 100x 100 mm + Die Size max. 10x10 mm + Die Size min. 0,3 x 0,3 mm
	GOV