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P. 02
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Micro-welder
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HB16
Wedge and Bail Bonder
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ipr
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+ Wedge, Bail and Bump bonding
+ 17p to 50|j Wire and 25\s x 200|j Ribbon
+ 6,5" TFTTouch panel opération System
+ Deep-access Bond Head 16 mm
+ Bond arm length 165 mm
+ 100 Program storage capacities,
+ Built in Dual Fiber Optic illuminator
+ Motorised Z Bond Head
+ Motorized Y travel for Step-Back loop control
+ Motorized 2" Wire Spool Holder
+ 6:1 ratio X-Y manipulator
+ High/Low Ultrasonic Selector 1 or 2 watt
+ FDD 3,25" to store Bonding programs
+ Electronic bail size control
+ Loop Profile Programmable
+ Stitch bonding and Bump bonding
+ Semi-auto, Step and Manual Bonding Mode
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