HB14 Ball Bonder - TPT Wire Bonder, Franz & Fabian Hickmann GbR - (Version JPG) - PDF Catalogue | Technical Documentation

See other catalogues for TPT Wire Bonder, Franz & Fabian Hickmann GbR

Micro-welder

Text version of the page



		HB14 Ball Bonder

				+ 17m to 50\|j Gold Wire + 6,5" TFT Touch panel operation System + Deep-access Bond Head 16 mm + Bond arm length 165 mm + 100 Program storage capacities + Heater stage Controller + Built in Dual Fiber Optic illuminator + Motorised Z Bond Head + Motorized Y travel for Step-Back loop control + Motorized 2" Wire Spool Holder + 6:1 ratio X-Y manipulator + High/Low Ultrasonic Selector 1 or 2 watt + FDD 3,25" to store Bonding programs + Electronic ball size control + Loop Profile Programmable + Stitch bonding and Bumpbonding + Semi-auto, Step and Manual Bonding Mode