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Tinius Olsen
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Peel Test Fixtures Tinius Olsen CLIMBING DRUM PEEL UNIT Description: Climbing drum peel unit comprising a flanged drum with integral clamp for holding the free end of the test assembly. The opposing end is attached to the load cell. The drum is made to rotate by applying tension to the chains attached to the outer rims. This action produces a peel action on the adhesive bond. For ease of handling, the drum assembly is supported with Bowden cables. Compatible with: Benchtop materials testing machines. Applications: For determining the perpendicular peel strength of adhesive bonds between the core and outer skin of sandwich assemblies, typically honeycomb and other composites. Specifications • Conforms to BS5350 Part C13, ASTM D1781 • Maximum capacity: 5kN/1,000lbf • Minimum load cell: 100N/20lbf • Drum diameter: 102mm/4in • Maximum sample width: 75mm/3in • Weight top clamp: 900g/2lb • Weight drum assembly: 2.5kg/5.5lb • Temperature limits: -30-200°C Specifications • Maximum capacity: 1.5kN/300lbf • Minimum load cell: 50N/10lbf • Maximum sample width: 50mm/2in • Test plate length: 200mm/8in • Weight: 675g/1.49lbf • Temperature limits: -70-100°C 180 DEGREE PEEL UNIT Description: 180 degree peel unit comprising a test bed with a spring-loaded retaining plate for locating various test panels on which the peel sample is bonded. An HT50 grip is supplied to grip the free end of the sample. Compatible with: Benchtop materials testing machines. Applications: Flexible pressure sensitive tapes, labels and laminated coatings.
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Peel Test Fixtures Tinius Olsen 90 DEGREE PEEL UNIT Description: The 90 degree peel unit is comprised of a moving test plate mounted on bearings. To maintain a constant peel angle, the test plate is driven in unison with the testing machine crosshead via a cord and pulley system. The printed circuit board (PCB )sample is retained on the test plate with a slotted clamp plate. An HT50 grip is supplied to grip the PCB copper strip. Compatible with: Benchtop materials testing machines. Applications: Specifically designed for peel testing the bond between copper and PCBs. Specifications •...
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