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Gold coating - THERMOCOMPACT
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Gold coating - THERMOCOMPACT


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solex-science-DE-outside table.main {} tr.row {} td.cell {} div.block {} div.paragraph {} .font0 { font:7.00pt "Arial", sans-serif; } .font1 { font:8.00pt "Arial", sans-serif; } .font2 { font:9.00pt "Arial", sans-serif; } .font3 { font:10.00pt "Arial", sans-serif; } .font4 { font:11.00pt "Arial", sans-serif; } .font5 { font:12.00pt "Arial", sans-serif; } .font6 { font:13.00pt "Arial", sans-serif; } .font7 { font:17.00pt "Arial", sans-serif; } .font8 { font:19.00pt "Arial", sans-serif; } .font9 { font:5.00pt "Arial Black", sans-serif; } Revêtement Or Passementerie, haute couture, connecteurs électroniques. Matières Premières Composition chimique en% Densité 0fem3 Résistlvité @ 20*Cjjacm n cmiim Charge de Rupture o Laminé écroul daN/mnv psi 45 65.000 recurt daN.'mnV psi 24 35.000 Monobrin mm ewg Toron mm* awg (*) Cuivre argenté Revêtement Ag > 1 % 1.72-1 10,371 0.C4C-C.E 20:o46 0.013-4,950 I2to40 (") Cuivre nickelé RMtamentNi >2% 1724 10.371 45 65.000 24 35.000 0.C4C-C.Ë 20ÎO46 0.013-4.950 12to40 C J Or îl^x 1.880 11,309 45 65.000 24 35.000 0.C8C-CE 20ÎO4C 0.013-4.950 12to40 Aigenl 990 Ag99% 10.47 ,378 2.100 12.633 44 64.000 22 'ô'ô'j 0.C6C-CE 20to46 0.013-4.950 12to40 C J N,c<ei N 992% 321 9.500 57.148 87 126.000 45 65.000 OJCC-CE 20:o3â C- 80 % 20 % 8.65 31.883 123.000 OJCC-CE 20to38 .312 d// dafa gvVen in thèse tables should be considered as typical or average. Variations in properties can ocour (*) Dual plating

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