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HBR50 Hotbar Reflow Solder, Heat Seal and Heat Stake brochure - techMatrix, LLC
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HBR50 Hotbar Reflow Solder, Heat Seal and Heat Stake brochure - techMatrix, LLC
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HBR50 Hotbar Reflow Solder, Heat Seal and Heat Stake brochure - techMatrix, LLC


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teehMatrix, LLC
HBR50 Series Hot Bar Solder, Heat Seal Bonding and Staking Machine
Built on the proven success of the RSX50 platform, the HBR series is designed for low to medium volume attachment of electrical devices to printed circuit boards.
TYPICAL APPLICATIONS:
o Edge connectors, flex circuits Ribbon & coax cables to PCB
Thermocompression bonding Heat Seal Connectors Anisotropic Conductive Films (ACF)
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HBR50 Shown with hood removed
■ Semi-automatic hot bar (reflow) solder, TAB, and heat staking platform
■ Gantry robot automaticall moves thermode (i.e. hot bar) to multiple positions on the PCB
■ Automatic adjustment of thermode pressure
■ Ideal platform for attaching exposed, single sided, or open windowed flex leads
Reflow multiple PCB and flex leads while operator loads/unloads machine Features ■ Dramatically increase throughput compared to basic system
■ Benefits ■ Maximize the utilization of a single thermode temperature controller.
■ Flexible and Fully Configurable Platform
■ HBR50 available with any combination of X, Y, Z, or theta axes
■ To prevent thermode contamination from flux, use an optional polyimide (Kapton) tape & reel
■ For ACF bonding, a tape cutter and feeder can be added
■ Manage thousands of temperature schedules with WeldWorks Software Suite
■ Easily manage all your PCB's part numbers, fixtures, and temperature schedules
■ Maintain process control with integrated SPC charts, histograms, and box-plot charts
■ Analyze reflow temperature data and print reports and graphs on any PC with a browser
Phone: 1-612-605-8312
Web: www.techMatrixLLC.net
E-mail: info@techMatrixLLC.net
7165 Tartan Curve Eden Prairie, MN 55346 USA
teehMatrix, LLC
Rev 1

pageCatalog pdf di En 2012-06-22-01