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Factory Automation Technology

Flip Chip Bonder - 34778 Flip Chip Bonder AFM-15

Ultrasonic Gold-to-Gold Interconnect

Specifications AFM-15AFM-22MDM-20Bonding Process Gold-to-gold interconnectionHeat compressionGlue dispensing(ultra sonic)(NCP, ACP, NCF, ACF, C4 and etc) Products TCXO, SAW, OPTO,Module, OPTO and etcAll of left productsHigh Frequency and etc IC MAX: 5.0W x 5.0D x 1.0T mmMAX: 30W x 30D x 0.635T mm–MIN: 0.3W x 0.3D x 0.1T mmMIN: 3W x 3D x 0.25T mm– Board MAX: 180W x 120D x 3.2T mmMAX: 180W x 120D x 1.6T mmMAX: 200W x 150D x 2.0T mmMIN: 50W x 50D x 0.3T mmMIN: 50W x 50D x 0.4T mmMIN: 30W x 30D x 0.3T mm Cycle Time 0.8sec/IC5.0sec/IC–(excluding bonding process time)(excluding bonding process time) Accuracy ± 8 µ m/3 σ± 3 µ m/3 σ± 10 µ m(nozzle positioning accuracy) MAX Load 20N (special 100N) 372.4N– IC Supply 5/6 inch wafer (8 inch option)2inch tray and etc– θ axis correctionHot blow Production management data Machine size Option and 1,200W x 1,450D x 1,550H mm 750W x 910D x 1,760H mm 740W x 1,140D x 1,550H mm Magazine Loader/UnloaderMagazine Loader/UnloaderMagazine Loader/Unloader Machine weight Special Features 2,000kg 1,100kg 680 kg IonizerIonizerPost heater table Carrier handling3.4inch trayCarrier handlingHepa-filter6inch waferDispensing monitoring Plasma cleaning unitLow pressure capability (min: 10g)Sylinge temperature adjustment Load/US sampling Nozzle surface monitoring 8 inch wafer Map data High accuracy mode Standard Features Pre/Mounting heater tableMounting heater tableVarious dispensing featuresNozzle auto cleaning & monitoringHepa-filterNozzle auto cleaning US checkingParallelism verificationPre/Dispense heater table IC height measurementBonding position verificationHeight detection Bump detectionTemperature calibrationProduction management data Wafer expandProduction management data Wafer

Key Features

? For High Precision Cost-Sensitive Applications All in one process for mounting and bonding? High Speed and Accuracy Mounting µ m? Small Footprint: Speed: 0.8 sec/IC Chip Component Accuracy: +/- 8 1.7 Square Meters? Easy Operation with Color Touch Screen? Inspection of Known Good Die from wafer? Capable to handle FR4, Ceramic or Silicon No CleanNo Lead Process