Catalogue Film Manifold
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Film Manifold (patent pending)
The Film Manifold consists of several layers of resin film bonded together, in which fine channels are engraved. It is much smaller and lighter than glass or resin block manifolds and can be used with jliTAS applications like chips or reactors. It is bendable and temperature control of the flow path is easy. Our miniature suppliers of valves etc. can be mounted on the film manifold.
Max. dimensions
W250mmxL250mm
Material
Polyimide, Polyethylene naphthalate
Min. channel width
50 jum
Layer thickness
25 jum, 50 jum, 75 jum
Examples of film manifold and small valve combinations
Note: The Film Manifold is developed in cooperation with SOHKiCo,.Ltd. Specifications and other details may be changed without prior notice.
TAKASAGO ELECTRIC, INC.
66 KAKITSUBATA, NARUMI-CHO, MIDORI-KU, NAGOYA, 458-8522 JAPAN Tel +81-52-891-2301 Fax+81-52-891-7386
E-mail: info@takasago-elec.co.jp URL: http://www.takasago-elec.co.jp/
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