Film Chips - TAKASAGO ELECTRIC, INC. - #1

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TAKASAGO ELECTRIC, INC. 66 KAKITSUBATA, NARUMI-CHO, MIDORI-KU, NAGOYA, 458-8522 JAPAN Tel +81-52-891-2301 Fax+81-52-891-7386 E-mail: info@takasago-elec.co.jp URL: http://www.takasago-elec.com 2007.09 Film Chip (patent pending) The Film Manifold consists of several layers of resin film bonded together, in which fine channels are engraved. It is much smaller and lighter than glass or resin block manifolds and can be used with ìTAS applications like chips or reactors. It is bendable and temperature control of the flow path is easy. Our miniature valves etc. can be mounted on the film manifold. Max. dimensions W250mmxL250mm Material Polyimide, Polyethylene naphthalate Min. channel width 50ìm Layer thickness 25ìm, 50ìm, 75ìm Examples of film manifold and small valve combinations Note: The Film Manifold is developed in cooperation with SOHKi Co,.Ltd. Specifications and other details may be changed without prior notice.