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| | | PRECAUTIONS | | |
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| | | LEM Type,LB Type,CB Type | | |
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| | | Stages | | Precautions | | Technical considerations | | |
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| | | LCircuit Design | | |
| | | Operating environment I.The products described in this specification are intended for use in general electronic equipment,(office supply equipment, telecommunications systems, measuring equipment, and household equipment). They are not intended for use in mission-critical equipment or systems requiring special quality and high reliability (traffic systems: safety equipment, aerospace systems, nuclear control systems and medical equipment including life-support systems,) where product failure might result in loss of life, injury or damage. For such uses, contact TAIYO YUDEN Sales Department in advance. | | |
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| | | 2.PCB Design | | PRECAUTIONS [Recommended Land Patterns] Surface Mounting ■ Mounting and soldering conditions should be checked beforehand. ■ Applicable soldering process to this products is reflow soldering only. | | |
| | | Land pattern design LPIease contact any of our offices for a land pattern, and refer to a recommended land pattern of a right figure or specifications. | | |
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| | | Unit : mm | | |
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| | | | | | | | | | | | TYPE | A | B | C | | | | 1608 | 0.55 | 0.7 | 1.0 | | | | MF160S | 0.55 | 0.8 | 1.0 | | | | 2012 | 0.7 | 0.8 | 1.45 | | | | 2016 | 0.7 | 0.8 | 1.8 | | | | 2518 | 0.8 | 1.2 | 2.0 | | | | LEM2520 | 0.9 | 1.5 | 1.5 | | | | 3218 | 1.0 | 1.6 | 2.0 | | | | 3225 | 1.0 | 1.6 | 2.7 | | | | | | | | | | | |
| | | ■ Recommended Land Patterns | | |
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| | | 3.Considerations for automatic placement | | 1.Excessive impact load should not be imposed on the products when mounting onto the PC boards. 2.Mounting and soldering conditions should be checked beforehand. Wave soldering (LEM Type only) I.For wave soldering,please apply conditions meeting the range of the specifed conditions in our catalog or the relevant specifications. Reflow soldering (LB and CB Types) 1 .For reflow soldering with either leaded or lead-free solder,the profile specified in "point for controlling" is recommended. Reflow soldering (LEM) I.For reflow soldering, please apply conditions meeting the range of the specified conditions in our catalog or the relevant specifications. | | |
| | | 1. When installing products, care should be taken not to apply distortion stress as it may deform the products. | | |
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| | | 4.Soldering | | |
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| | | 1.Components can be damaged by excessive heat whre soldering conditions exceed the specified range. | | |
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| | | 1.Reflow profile | | |
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| | | 300 250 200 150 100 50 | | | | | | | | | | | | Peak Temp: 250±5°C | | | | | | / \ 5 sec Max | | | | 180°C--r- | Pre-heat zone | -J-\—230°C Minn | | | | 150°C -J«r- | | -J |<-1\\ | | | | / | 90±30 sec | ~H30±10sec\ | | | | | | | | | | |
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| | | Recommended conditions for using a soldering iron I.Put the soldering iron on the land-pattern. Soldering iron's temperature-Below 350°C Duration-3 secons or less The soldering iron shoud not come in contact with inductor directly. | | |
| | | 1.Components can be damaged by excessive heat whre soldering conditions exceed the specified range. | | |
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| | | S.CIeaning | | LEM Type, LB Type, CB Type 1.lf washing by supersonic waves, supersonic waves may cause broken products. | | |
| | | Cleaning conditions LEM Type, LB Type, CB Type LWashing by supersonic waves shall be avoided. | | |
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| | | 6.Handling | | Handling LKeep the inductors away from all magnets and magnetic objects. Breakaway PC boards (splitting along perforations) LWhen splitting the PC board after mounting inductors, care should be taken not to give any stresses of deflection or twisting to the board. 2.Board separation should not be done manually, but by using the appropriate devices. Mechanical considerations LPIease do not give the inductors any excessive mechanical shocks. | | |
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| | | 1.There is a case that a characteristic varies with magnetic influence. | | |
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| | | 1.Planning pattern configurations and the position of products should be carefully performed to minimize stress. | | |
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| | | 1.There is a case to be damaged by a mechanical shock. | | |
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| | | 7.Storage conditions | | Storage 1.To maintain the solderability of terminal electrodes and to keep the packing material in good condition, temperature and humidity in the storage area should be controlled. ■Recommended conditions Ambient temperature 0---40°C Humidity Below 70% RH The ambient temperature must be kept below 30°C Even under Ideal storage conditions, solderability of products electrodes may decrease as time passes. For this reason, LE type inductors should be used within one year from the time of delivery. LB type Please should be used within 6 months from the time of delivery LE type In case of storage over 6 months, solderability shall be checked before actual usage. | | |
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| | | 1. Under a high temperature and humidity environment, problems suchas reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. | | |
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| | | TAIYO YUDEN 200S | | |
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