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20V Dual N- Channel MOSFET - Taiwan Semiconductor


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TAIWAN
SEMICONDUCTOR
TSM3900D
20V Dual N-Channel MOSFET
RoHS
COMPLIANCE
PRODUCT SUMMARY
SOT-26
654
Vos (V)
rds(on)(mQ)
Id (A)
55 @ VGS = 4.5V
2.0
20
70 @ VGS = 2.5V
1.5
110 @VGS= 1.8V
1.0
Block Diaqram
Pin Definition:
1.Gate1 6. Drain 1
2. Source 2 5. Source 1
3. Gate 2 4. Drain 2
1 23
Features
• Advance Trench Process Technology
• High Density Cell Design for Ultra Low On-resistance
Application
• Load Switch
• PA Switch
Ordering Information
Di O
Da o
1 O-1& ' k G2
O-
1
r
Ô
s.
Part No.
Package
Packing
TSM3900DCX6 RF
SOT-26
T&R
s2
Dual N-Channel MOSFET
Absolute Maximum Rating (Ta = 25°C unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Vds
20
V
Gate-Source Voltage
Vgs
±8
V
Continuous Drain Current
Id
2
A
Pulsed Drain Current
I dm
8
A
Continuous Source Current (Diode Conduction)3'"
Is
1.6
A
Maximum Power Dissipation
Ta = 25°C
Pd
2.0
W
Ta = 70 °C
1.3
Operating Junction Temperature
Tj
+150
°C
Operating Junction and Storage Temperature Range
Tj, Tstg
-55 to+150
°C
Thermal Performance
Parameter
Symbol
Limit
Unit
Junction to CaseThermal Resistance
ROjc
30
°c/w
Junction to Ambient Thermal Resistance (PCB mounted)
ROja
80
°c/w
Notes:
a. Pulse width limited by the Maximum junction temperature
b. Surface Mounted on FR4 Board, t < 5 sec.
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Version: A07

pageCatalog pdf di En 2012-06-22-01