Laser Dicing System - Synova - #1

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Laser Dicing System Powered by Laser MicroJet ® Expand your capabilities with the latest development in Laser Technology LDS Series Discover the Synova Laser Dicing System Innovative Laser Systems Asia Pacific Synova Asia Pacific Hong Kong Email : info @ synova-asia.com Enti re add resses a re availa ble on : http : //www.synova.ch North Ame rica Synova USA Inc. Delaware USA Email : info @ synova-usa.com Corporate Head qua rte r Synova SA Chemin de la Dent d’Oche 1024 Ecublens Switzerland Tel ( 41) 21 694 350 0 Fax ( 41) 21 694 35 01 info @ synova.ch Micro Machining centers, Subsi dia ries and dis tributors in : Cali fornia • Masa chusets • Japa n • South. Korea • Chi na Tai wan • Philipi nes • S ingap ore • Mala ysia • Thaila nd • Indonesia • India General Specifications · LDS 200 · LDS 300 Axes Type XY.-Table with separate axes on granite base Drive Linear motors Useable working area 240 x 240 mm Maximum stroke ( X x Y.) 600 x 400 mm Precision < 3 ìm Repeatability < 1 ìm Maximum axis speed 1000 mm /s Acceleration 10 m /s 2 Index 0.0001 mm Optical Head Type Transmission of laser light from fiber to water jet nozzle Image ratio 4 :1, 6 :1 or 8 :1 Nozzle diameter 25 ìm, 30 ìm, 35 ìm, 40 ìm, 50 ìm, 60 ìm, 75 ìm or 100 ìm Alignment V ision controlled Laser Laser type Solid state Nd :YAG, pulsed Wavelength 1064 nm or 532 nm Average power 100 W, optional 200 W Beam transmission O ptical fiber 100 ìm - 200 ìm, length 10 m Water Pump Type Two-cylinder pressure amplifier Water flow max. 1 l /min, DI-water, particles < 3 ìm Average water flow for cutting 0.05 l/min Water pressure 50 to 500 bars ( 5 to 50 MPa ) Pressure transmission F lexible water hose DI-Water flow for cleaning Max. 1 l / min, DI-water, particles < 3 ìm Utilities Electrical power 400V./ 230V, 50 /60 Hz Power consumption 10 kV.A Air pressure 5 - 6 bars, oil free Water flow for cooling Max. 8 l / min, max 16 °C, industrial water Water flow for cutting 0.05 l / min, < 0.3 ìm, degasified The above specifications are subject to change without notice due to technical improvement. The Laser Dicing System incorporates the worldwide patented technology of water jet guided laser, invented at the Swiss Federal Institute of Technology, Lausanne, Switzerland. This machine conforms to CE regulations. LDS 200 LDS 300 Work piece Wafer size 1” to 8” ( LDS 200 ) to 12”( LDS 300 ) Applicable tape Among others Lintec 611 and 628, LaserTape ® Applicable tape frame 6” ( LDS 200 ), 8” or 12”( LDS 300 ) Dimensions / Weight Basic machine (W x D x H) LDS 200 M : 1163 x 950 x 1625 mm LDS 200 C.: 1163 x 1170 x 1625 mm LDS 200 A : 1163 x 1170 x 1625 mm LDS 300 M : 1163 x 950 x 1625 mm LDS 300 C.: 1163 x 1505 x 1625 mm LDS 300 A : 1163 x 1505 x 1625 mm Weight LDS 200 M / 200 C / 300 M / 300 C.: 850 kg LDS 200 A : 900 kg LDS 300 A : 950 kg Laser ( W x D ) 1500 x 750 mm 177.5 kg Water pump ( W x D ) 1340 x 750 mm 350 kg Vision System Type Pattern matching Magnification Two-level ( high / low magnification ) Illumination C oaxial LE D light Automatic alignment method Image processing, alignment time < 5 s Quality control Kerf check by image analysis Cleaning Station LDS 200 C../ A Cleaning Megasonic and high pressure water jet Drying F ront and backside with Nitrogen Loading Station LDS 200 A Cassettes 6” ( LDS 200 ), 8” or 12” ( LDS 300 ) Frames Single frame drawer Options 200 V transformer V acuum pump Uninterruptible power supply