| | | | | | |
| | Axes | | Workpiece | | |
| | Type | XY-Table, with separate axes on granite base | Wafer size | 6" to 8 ' ' | |
| | Drive | | Wafer thickness | Any thickness | |
| | Useable working area | 240 x 240 mm | | | |
| | Maximum stroke (XxY ) | 600 x400 mm | Cleaning Station LGS 200 C, A | |
| | Precision | +/ - 3 urn | Cleaning | DI water jet (high-pressure and | |
| | Repeatability | 1 urn | | megasonic optional) | |
| | Maximum axis speed | 1000 mm / s | Drying | Front and back side | |
| | Acceleration | IG | | | |
| | Index | 0.1 urn | Loading Station LGS 200 A | |
| | | | Cassettes | max. 3 wafer cassettes (6" and 8 ") | |
| | | | | Single wafer drawer | |
| | | | |
| | Laser types | Solid state Nd:YA G pulsed | | | |
| | Wavelength | 1064 nm, 532 nm | Electrical power | 3 x 400V and 1 x 230V, 50 /60 Hz | |
| | Average power | 100 W | Power consumption | 20 kVA | |
| | Beam transmission | Optical fibre, core diameter ISO urn | Air pressure Water flow for cooling Water flow for cutting | 5- 6 bars, oil free max. 15 1 / min, max I6°C, industrial water max. 0.05 1 / min, <0.3 urn, degassed | |
| | | Water flow for cleaning | max. 1 1/ min, Dl-water, <0.3 urn | |
| | Type | | | | |
| | Water flow | 0.05 1/ min | | | |
| | Water pressure | 20 - 500 bars | Dimensions /Weight | | |
| | Pressure transmission | | LGS 200 M (Wx D, weight) | 1 140 x 820 mm approx. 800 kg | |
| | | 30, 35, 40, 50, 60, 75 and 100 urn | LGS 200 C (Wx D, weight ) LGS 200 A (Wx D, weight ) | 1140 xllOO mm approx. 900 kg 1546 x 1107.5 mm approx. 950 kg | |
| | | | | 2550 x 650 mm approx. 900 kg 1300 x 700 mm approx. 35 0 kg | |
| | Type | Pattern matching | |
| | Magnification | Two-level (high/low magnification) | | | |
| | Optical magnification | 0.58 x 7.0 | Options | Transformer | |
| | Illumination | Coaxial LED lightening | | | |
| | Automatic alignment | By image processing, alignment time < 5 s | | Chiller | |
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