3 pages in the catalogue
Laser Dicing System |
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Laser Dicing System p 1 General Specifications · LDS 200 · LDS 300 LDS 200 LDS 300 Axes Work piece Wafer size 1” to 8” ( LDS 200 ) to 12”( LDS 300 )Applicable tape Among others Lintec 611 and 628, LaserTap... |
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Laser Dicing System p 2 Fast & Accurate The LDS’s stable structure and linear motors are key to achieving high precision, high speed and accuracy in wafer dicing. Integrating the latest image processing software, the ... |
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Laser Dicing System p 3 $ISCOVER ... |
