Catalogue Soldering procedure SHT11/SHT15 humidity sensors
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SHTxx Application Note Soldering Procedure

3 Revision history

Date Revision Changes August 22, 2001 1.0 Initial revision January 17 , 2002 1.1added manual soldering instructions, soldering quality February 19 , 2002 1.11 New CI June 18, 2002 1.2 Added PCB cleaning paragraph Oct. 16. 2003 1.3Added lead free soldering capability Oct. 17, 2003 1.4Changed download link Feb. 02, 2004 1.5Changed PCB cleaning paragraph, only use “No-Clean” solder paste Feb. 24, 2004 1.51 Increased peak temperature for reflow to 250°C May 25, 2005 1.52 Changed company address September 20, 2005 1.6Corrected Peak Temperature for lead-free soldering Sept 22, 2006 1.7Corrected Peak Temperature for VPR lead-free soldering Oct 03, 2006 1.8 Sensirion Inc. address added The latest version of this document and all application notes can be found at: www.sensirion.com/humidity

Headquarters and Sales Office

SENSIRION AG Phone: + 41 (0)44 306 40 00 Laubisruetistr. 50 Fax: + 41 (0)44 306 40 30 CH-8712 Staefa ZH e-mail: info@sensirion.com Switzerland http://www.sensirion.com/ SENSIRION Inc Phone: 805-409 4900 Westlake Pl. Ctr. I, suite 240 Fax: 805-435 0467 2801 Townsgate Road e-mail: michael.karst@sensirion.com Westlake Village, CA 91361 http://www.sensirion.com/ USA
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