AXIALSCAN - Raylase - #1

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RAYLASE focus on laser 3-AXIS LASER BEAM SUBSYSTEMS I AXIAL Flexible Wide Field Processing with Smallest Spot Diameter Variable, easy to adjust working f ields 100 x 100 to 1,500 x 1,500 mm2 Modular and compact design for easy intégration High power option of up to 2.5 kW High speed Z-axis with double motor option • design The AXIALSCAN subsystems offer very small spot diameters at large field sizes, flexibility, high scanning speeds, long-term stability and low drift values for superior quality standards. This combination results in high power density in the spot, enabling new applications and reduced system costs. The modular, compact, robust and pre-aligned design (CE) makes integration easy. RAYLASE products combine optimised optics, fine tolerance mechanics, superior electronics and galvanometer scanners. • field sizes Subsystems for CO2 lasers are designed for field sizes from 100 mm x 100 mm up to 1,500 mm x 1,500 mm and for Nd:YAG from 200 mm x 200 mm up to 1,200 mm x 1,200 mm. Field sizes for subsystems of other wavelengths available upon request. • quality Maintaining high product quality standards is a priority at RAYLASE. Subsystems are shipped to customers only after extensive tests. • optics Objectives, protection windows and mirrors are available for all typical laser types. • axialscan motorized This option of the AXIALSCAN enables motorized adjustment of the size of the operating field steered by stepper motor interface. • other models upon request AXIALScAN-Hp - High Power with optimized Nd:YAG and CO2 optics for up to 2.5 kW • axialscan-hs - High Speed with double motor driven Z-axis axialscan-ld - Low Drift water tempered option to reduce drift effects • interfaces The subsystems are electrically and mechanically compatible to the XY2-100 standard. They can be controlled either by a digital interface via the high-speed data link, for example with a SP-ICE card, or by using an analog current or voltage interface. • typical applications Material processing (cutting, perforating, welding, drilling), micro machining, processing on the fly, 3D-applications, stereolithography, rapid tooling /manufacturing.