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Text version of the page
FM20L08 - Extended Temp.
AWH Write Timing spec. Added typ value to V
TP in DC Operating table. Changed software write-protect scheme. Changed /LVL to Output-only pin. Modified Block Diagram, Pin Description and DC Operating tables. Modified package drawing title. 0.61 5/20/04 Changed t
WX , t
AAP , and t
AWH specs. Added t
AH to Write Cycle parameters table. Changed input rise/fall time AC test condition. Changed t
VF units. Added “green” package. 0.7 9/3/04 Reduced to one speed grade and changed to -60 speed grade. Supply voltage 3.3V +10%, -5%. Temp range 0 to +85C. 0.8 12/20/04 Temp range 0 to +70C. Changed AC timing parameters. Changed part number/ordering information. 1.0 3/25/05 Changed to Preliminary status. 1.1 5/23/05 Added “green” packaging option. Added marking scheme. 1.2 6/3/05 Removed –S packaging option. 1.3 6/13/05 Changed address setup and I
DD specs. 1.4 7/11/05 Added t
VR parameter. Added note about /CE high during power cycles. Modified Power Cycle timing diagram and added timing parameters. Removed references to the use of /LVL as a system reset signal. 1.5 10/18/05 Changed I
SB . Changed V
TP limits. Added note to Power Cycle Timing table. Rewrote text describing use of pullup resistor. 1.6 2/9/06 Order device with or without software WP. Changed t
PULV to 5ms. Added ESD and MSL ratings. 1.7 6/16/06 Extended upper temperature limit from 70
° C to 85
° C. Devices with date codes 0605 through0620 comply with this datasheet revision. 1.8 8/21/06 Extended lower temperature limit from 0
° C to -20
° C. Changed I
DD and I
SB specs. Updated ESD ratings. Removed Note 2 from Power Cycle Timing table. Devices with date codes 0624 and beyond comply with this datasheet revision. 1.81 4/9/07 Changed Package Marking Scheme. Updated ESD machine model and MSL ratings. 1.82 5/10/07 Added pcb footprint to package drawing. 1.9 5/6/2008 Removed –TGC1 (software write protect) ordering number.
Rev. 1.9 May 2008 Page 12 of 12
Parallel F-RAM Memory FM20L08 - 33928 Revision History
Revision DateSummary 0.6 1/30/04 Added Vdd fall time spec. Changed Power Cycle Timing diagram. Added tAWH Write Timing spec. Added typ value to V
TP in DC Operating table. Changed software write-protect scheme. Changed /LVL to Output-only pin. Modified Block Diagram, Pin Description and DC Operating tables. Modified package drawing title. 0.61 5/20/04 Changed t
WX , t
AAP , and t
AWH specs. Added t
AH to Write Cycle parameters table. Changed input rise/fall time AC test condition. Changed t
VF units. Added “green” package. 0.7 9/3/04 Reduced to one speed grade and changed to -60 speed grade. Supply voltage 3.3V +10%, -5%. Temp range 0 to +85C. 0.8 12/20/04 Temp range 0 to +70C. Changed AC timing parameters. Changed part number/ordering information. 1.0 3/25/05 Changed to Preliminary status. 1.1 5/23/05 Added “green” packaging option. Added marking scheme. 1.2 6/3/05 Removed –S packaging option. 1.3 6/13/05 Changed address setup and I
DD specs. 1.4 7/11/05 Added t
VR parameter. Added note about /CE high during power cycles. Modified Power Cycle timing diagram and added timing parameters. Removed references to the use of /LVL as a system reset signal. 1.5 10/18/05 Changed I
SB . Changed V
TP limits. Added note to Power Cycle Timing table. Rewrote text describing use of pullup resistor. 1.6 2/9/06 Order device with or without software WP. Changed t
PULV to 5ms. Added ESD and MSL ratings. 1.7 6/16/06 Extended upper temperature limit from 70
° C to 85
° C. Devices with date codes 0605 through0620 comply with this datasheet revision. 1.8 8/21/06 Extended lower temperature limit from 0
° C to -20
° C. Changed I
DD and I
SB specs. Updated ESD ratings. Removed Note 2 from Power Cycle Timing table. Devices with date codes 0624 and beyond comply with this datasheet revision. 1.81 4/9/07 Changed Package Marking Scheme. Updated ESD machine model and MSL ratings. 1.82 5/10/07 Added pcb footprint to package drawing. 1.9 5/6/2008 Removed –TGC1 (software write protect) ordering number.
Rev. 1.9 May 2008 Page 12 of 12