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Mechanical Dimensions:

The RadEye1 array is “buttable” on three sides, meaning that larger sensors can be formed by tiling two or more devices together in a mosaic. The physical die area includes a ~50µm border zone surrounding the active area. The ceramic substrate is sized slightly smaller than the RadEye1 die. The silicon die overhangs the substrate and is extremely fragile. Special care must be taken to prevent chipping of the die edges or scratching of the die surface! We strongly recommend mounting the sensor in a protective housing, and exercising extreme caution when bonding a scintillator screen to the active surface.The EV version of the RadEye1 sensor includes a fiber-optic faceplate that is permanently attached to the active area of the die. The FOP provides a robust and easily cleanable interface that helps protect the sensor from accidental damage. Its dimensions are 26.0 mm by 50.4 mm by 3.0 mm.
24.7 mm

active area:24.6 x 49.2

70.1mm

Connector Pinout:

Pin Type Signal Description
2.5 1 VDD Power (+5V)
1.7Ø3.1 2 GND Ground
Ø1.0 (2x) 3 A OUTS Video Output + 4 A OUTR Video Output -
6.7 1 11.4 5 GND Ground 6 A VD Reference In
24.1 mm 7 GND Ground 8 D SCAN Scan Mode In
optional FOP(EV version) 9 D START Frame Start In
4.8mm 4mm 10 D CLOCK Master Clock In 11 D BIN Binning Select In 12 D NDR NDR Select In 13 D FRAME Frame Sync Out 14 D LINE Line Sync Out Connector: Samtec P/N FC1-15-02-T-WT (mates with 15-conductor flex cable, Samtec P/N FJ-15-D-x.xx-4) 15 GND Ground
Type: A = Analog Signal D = Digital Signal

Ordering Information:

Rad-icon P/N Description RE1002-01 RadEye1 Image Sensor, Premium Grade
(no line defects) RE1002-02 RadEye1 Image Sensor, Standard Grade
(up to three line defects) RE1139-01 RadEye1 EV Sensor, Premium Grade RE1139-02 RadEye1 EV Sensor, Standard Grade Rad-icon Imaging Corp 3193 Belick Street, Unit 1 Santa Clara, CA 95054 tel 408-486-0886 fax 408-486-0882