QuickLogic ArcticLink Solution Platform Brief - Quicklogic - #1

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Analog Devices MediaTek Samsung Freescale™ nVIDIA® SiRF Intel® Qualcomm STMicro Marvell® RMI™ TI Programmable Fabric (Standard or Custom Functions) + Intelligence Key Platform Features The ArcticLink™ Solution Platform family of programmable connectivity combines interconnect building blocks, such as Hi-Speed USB 2.0 OTG, SDIO and CE-ATA Host Controllers, with an embedded ultra-low power programmable fabric block, all in a single-chip solution. The combination of small form factor packaging, ultra-low power technology and host bus interface configurability makes this platform ideal for addressing emerging connectivity requirements in powercritical portable and mobile consumer electronics applications. Through the on-chip programmable fabric, the host bus interface can be tailored to expand the peripheral set of a broad variety of common mobile application processor families, to meet the emerging connectivity requirements for wired/wireless communications and media storage. With an innovative internal split bus architecture, the platform enables sustained and concurrent data transfers between slow- and high-speed peripherals, and to/from the common programmable fabric-based host interface. The world’s first ultra-low power, integrated programmable connectivity platform from QuickLogic® ! Integrated, single-chip solution for multiple peripheral host controllers and interfaces to reduce both system BOM cost and board space. ! Flexible platform with configurable Hi-Speed USB 2.0 On-The-Go (OTG), high-speed SDIO, multi-format storage solutions and programmable fabric for additional solutions, intelligence, and custom functions. ! Fast time-to-market with QuickLogic’s complete ultra-low power connectivity solutions. QuickLogic ArcticLink Solution Platform Brief ArcticLink Connectivity Solutions Programmable Connectivity Solution Platform