NEW 01 ~o c 0 cl ul c S! h TOM1203LP SMD Transponder Overmoulded Design 12.6x3.54x3.5 mm (340uH -16.2 mH) Features This design performs the highest mechanical standards ^^^^^^^^^^^^^^^^^ for an SMD component. Inductor based on a wound ferrite and ulterior I overmoulding which results in a compact component I with absence of mechanically weak points. Designed I to accomplish the highest electrical performance in I thǨse dimensions together with good thermal properties. I RTPMS, KES, Industrial with high requirements are I typical applications for this pice. Maximized sensitivity | and thermal performance for the design. LL ai Dimensions and recommended pad layout □ ri' Electrical spcifications Sensitivity P/N L (mH) Tol詩rance (pF) Q@125kHz SRF (mVDD/AD_/m) @125kHz (kHz) X @f55kPHz TOM1203LP-0238J 2.8 +5% 680 40 >800 >45 Please contact our sales department for any inquiry. Custom inductances and electrical parameters also available. Contact us for measurement spcification. 60

General Spcifications Transponder Inductors SMP Soldering and Packaging Soldering: recommended reflow profile Reflow soldering, vapour-phase soldering. A maximum soldering temprature of 260 °C during 10 s should not be exceeded for (see recommended soldering profile with maximum and minimum temperature-time). The reflow condition recommended above is according to the machine used by our company. Big diff驩rences will arise as a resuit of the type of machine, reflow conditions, method, etc used. Measuring equipments and conditions E ga u ai tj C 0 a. h 1.- Rated inductance Lr 2.-Qfactc-rQmiri 3.-...

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