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Epoxy-Free Bonding

• PPC has improved upon standard optical contacting by removing the “black art” from the optical bonding process. Our patent-pending Chemically Activated Direct Bonding™ (CADB™) technology results in epoxy-free optical paths that are perfectly transparent with negligible scattering and absorptive losses at the interfaces. It of- fers bond strengths often times equal to the strength of the bulk materials being bonded, resulting in assemblies that are exceptionally durable, reliable and resistant to changes in temperature and humidity. CADB can be used on uncoated surfaces or with our ion-beam-sputtered di- electric thin films making it an ideal process for monolithic optical assemblies and polarizing beamsplitters.With CADB, we can bond a variety of materials including fused silica, doped and undoped YAG, YVO
4 , phosphate glasses, KTP, spinel, silicon and sapphire. Contact us or go online for a complete list of materials and material combinations. In-house shear testing ensures production control and quantitative comparison data when using CADB on new materials.

CADB products and components: • Beamsplitter cubes• Waveguide structures • Air-gap etalons • Zero-order waveplates • Laser rods with endcaps • Custom monolithic assemblies

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